II-VI Incorporated Selected by Tianyu as Primary Strategic Partner to Supply Silicon Carbide Substrates for Power Electronics

Rhea-AI Summary

II-VI, a leader in wide-bandgap compound semiconductors, has been selected by Dongguan Tianyu Semiconductor Technology as the primary partner for supplying 150 mm SiC substrates for power electronics. This partnership is driven by the growing demand for SiC technology in electric vehicles, renewable energy, and smart grids. II-VI's global production capacity will support Tianyu's requirements, aligning with future developments in 200 mm substrates. This collaboration highlights II-VI's commitment to advancing SiC solutions, which also contribute to significant reductions in carbon emissions and energy usage.

Positive

• Partnership with Dongguan Tianyu strengthens market position in SiC substrates.
• Increased production capacity in the U.S. and China supports high-volume demand.
• Collaboration aligns with growing markets in electric vehicles and renewable energy.
• Potential for environmental benefits through reduced carbon dioxide emissions.

Negative

• None.

PITTSBURGH and DONGGUAN, China, Nov. 08, 2021 (GLOBE NEWSWIRE) -- II‐VI Incorporated (Nasdaq: IIVI), a leader in wide-bandgap compound semiconductors, today announced that it has been selected by Dongguan Tianyu Semiconductor Technology Co., Ltd., as its primary strategic partner for supply of 150 mm SiC substrates for power electronics.

The electrification of the transportation infrastructure is driving a market transition to power electronics based on SiC, a third-generation or wide-bandgap semiconductor, which enables power electronics to be smaller, more efficient, and with lower total system-level cost of ownership compared with state-of-the-art silicon-based devices. Tianyu, one of China’s first and largest SiC epitaxial wafer manufacturers, has recognized II-VI as a leading global supplier of high-quality 150 mm SiC with a long history of innovation and ability to achieve scale along with an aggressive 200 mm substrate roadmap.

“We’re excited to support Tianyu’s high-volume requirements for SiC substrates,” said Sohail Khan, Executive Vice President, New Ventures & Wide-Bandgap Electronics Technologies Business Unit. “Tianyu will immediately benefit from our 150 mm SiC global production capacity in the U.S. and in China.”

“II-VI is a world-class supplier of high-quality 150 mm silicon carbide substrates,” said Li Xiguang, GM of Tianyu. “Together, Tianyu and II-VI will provide the high-quality and reliable supply chain and future 200 mm capability that will be critical to support the rapidly growing demand for SiC power electronics in the mega-markets of electric vehicles, renewable energy, smart grids, microgrids, and power supplies for data networks.”

Due to their broad range of applications, power electronics based on SiC have demonstrated their potential to have a highly beneficial impact on the environment via significant reductions in carbon dioxide emissions and energy consumption.

About Dongguan Tianyu Semiconductor Technology Co., Ltd.

Dongguan Tianyu Semiconductor Technology Co., Ltd., is a high-tech enterprise specializing in the R&D, design, manufacturing, and sales of third-generation wide-bandgap semiconductor SiC epitaxial wafers. It has international advanced SiC epitaxial growth, inspection, and analysis equipment, and has built a mature SiC epitaxial R&D and industrialization platform. As a leader of the SiC epitaxial industry, Tianyu’s R&D strength and epitaxial supply capacity are of great significance to promote the R&D of the world’s third-generation wide-bandgap semiconductor materials and devices and the development of related industries. For more information, please visit us at www.sicty.com.

About II-VI Incorporated

II-VI Incorporated, a global leader in engineered materials and optoelectronic components, is a vertically integrated manufacturing company that develops innovative products for diversified applications in communications, industrial, aerospace & defense, semiconductor capital equipment, life sciences, consumer electronics, and automotive markets. Headquartered in Saxonburg, Pennsylvania, the Company has research and development, manufacturing, sales, service, and distribution facilities worldwide. The Company produces a wide variety of application-specific photonic and electronic materials and components, and deploys them in various forms, including integrated with advanced software to support our customers. For more information, please visit us at www.ii-vi.com.

CONTACT:
Mark Lourie
Vice President, Corporate Communications
corporate.communications@ii-vi.com 
www.ii-vi.com/contact-us

FAQ

What is II-VI's recent partnership announcement regarding SiC substrates?

II-VI has partnered with Dongguan Tianyu Semiconductor Technology to supply 150 mm SiC substrates for power electronics, supporting the growing demand in various markets.

How does the partnership with Tianyu affect II-VI's production capacity?

The partnership enables II-VI to leverage its global production capacity in both the U.S. and China to meet Tianyu's high-volume requirements for SiC substrates.

What markets are expected to benefit from II-VI's SiC technology?

The SiC technology is expected to benefit markets such as electric vehicles, renewable energy, smart grids, and data networks.

What are the environmental impacts of II-VI's SiC power electronics?

SiC power electronics can significantly reduce carbon dioxide emissions and energy consumption, contributing to environmental sustainability.