Infineon Technologies Ag - IFNNY STOCK NEWS

RS has released DesignSpark PCB version 12, a significant upgrade to its PCB design software, backed by Infineon Technologies. The new version introduces enhanced features for both free and paid subscription plans, building upon its existing platform that serves a 1.4-million-member community. Key improvements include pre-plot checks, new edit component options for high-pin footprints, angular precision settings, dual measurement units, and advanced Design Rule Check options.

The software, which has been providing professional-grade PCB design tools since 2010, maintains its user-friendly interface while adding capabilities like project-specific libraries, improved reference design conversion, and enhanced component management features. Infineon's support particularly strengthens the software's position in industrial automation and automotive industries.

Infineon Technologies has won the German Sustainability Award 2025 in the Electrical Engineering and Electronics category, recognized for its leading role in sustainability transformation. The company has made significant progress in its decarbonization strategy, reducing emissions by over two-thirds while nearly doubling revenue since 2020, targeting climate neutrality by 2030.

As an industry pioneer, Infineon now reports Product Carbon Footprint data for half of its products. A notable innovation is their new energy-saving silicon carbide module, which enhances efficiency in solar and wind power plants, train drives, and large machinery. A single electric locomotive using this system saves approximately 300 megawatt hours annually, equivalent to 100 homes' energy needs.

Infineon Technologies AG (FSE: IFX) (OTCQX: IFNNY) has developed the world's first 300 mm power gallium nitride (GaN) wafer technology, a groundbreaking achievement in high-volume manufacturing. This innovation will significantly drive the GaN-based power semiconductor market, offering 2.3 times more chips per wafer compared to 200 mm wafers.

GaN semiconductors are rapidly adopted in various applications, including AI systems, solar inverters, and motor-control systems. The 300 mm manufacturing process ensures improved device performance, efficiency, and customer supply stability. Infineon's success leverages existing 300 mm silicon production competencies, allowing for accelerated implementation and efficient capital use.

This breakthrough positions Infineon to shape the growing GaN market, estimated to reach several billion US-Dollars by the end of the decade. The company aims to achieve cost parity between GaN and silicon products, supporting its mission of decarbonization and digitalization.

Infineon Technologies AG and Amkor Technology, Inc. have signed a Memorandum of Understanding to promote decarbonization and sustainability across their supply chain. This partnership aims to:

• Engage with common suppliers to develop effective decarbonization strategies
• Identify areas for improvement in emissions reduction
• Support suppliers in setting science-based targets
• Provide guidance and track progress for continuous improvement

The collaboration expands on their existing Outsourced Semiconductor Assembly and Test (OSAT) relationship and aligns with both companies' sustainability goals. Infineon aims to become CO2-neutral for scope 1 and 2 by 2030, while Amkor targets net-zero emissions by 2050.

Cooler Master has expanded its partnership with Infineon Technologies AG to introduce the X series high-wattage power supplies. These new PSUs, ranging from 850W to 2000W, are designed for high-performance gaming, AI, and industrial applications. The collaboration combines Cooler Master's thermal and power design expertise with Infineon's advanced semiconductor technology.

Key products include the X Silent Series (industry's first 850W/1100W fanless PSUs), MAX Platinum 1300W, and X Mighty Platinum Series 2000W. These PSUs feature advanced thermal management, high conversion efficiency, silent performance, and digital monitoring capabilities. The partnership aims to meet evolving customer needs and drive decarbonization in high-performance computing.

Infineon Technologies AG partners with Amkor Technology, Inc. to strengthen its outsourced backend manufacturing footprint in Europe, establishing a packaging and test center in Porto. Operations set to begin in the first half of 2025, enhancing the semiconductor supply chain and resilience for automotive customers.

Vyvo Smart Chain partners with Infineon Technologies to enhance security for wearables and IoT devices. Infineon's OPTIGA™ Trust M provides tamper-resistant hardware and NVM for secured storage and encryption, reinforcing VSC's HealthFi ecosystem.

Arrow Electronics and eInfochips collaborate with Infineon Technologies to accelerate development of electric vehicle chargers. The partnership aims to address challenges faced by equipment manufacturers in developing DC fast chargers by providing a reference platform with innovative products and design services.

Infineon Technologies AG and Wolfspeed, Inc. have extended their long-term silicon carbide wafer supply agreement, including a multi-year capacity reservation agreement. This expansion contributes to Infineon's supply chain stability amid growing demand for silicon carbide semiconductor products in automotive, solar, EV applications, and energy storage systems. The adoption of silicon carbide-based power solutions is rapidly growing across multiple markets, enabling smaller, lighter, and more cost-effective designs, converting energy more efficiently to unlock new clean energy applications. Wolfspeed is positioned as the world's leader in silicon carbide production, with industry estimates indicating substantial growth in demand for silicon carbide devices and supporting material through 2030, representing a $20 billion annual opportunity.