Himax Technologies, Inc. to Attend 2021 Bank of America Merrill Lynch Asia Pacific Telecom, Media & Technology Virtual Conference on March 15 – March 24, 2021

Rhea-AI Summary

Himax Technologies, a leading fabless semiconductor manufacturer, will participate in the 2021 Bank of America Merrill Lynch Asia Pacific Telecom, Media & Technology Virtual Conference from March 15 to March 24, 2021. The company will host one-on-one meetings with investors during the event. This participation is by invitation only, emphasizing the exclusivity for interested stakeholders. Himax is recognized for its innovations in display driver ICs and other technologies, holding over 3,000 patents globally.

TAINAN, Taiwan, March 02, 2021 (GLOBE NEWSWIRE) -- Himax Technologies, Inc. (Nasdaq: HIMX) (“Himax” or “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced that the Company will attend 2021 Bank of America Merrill Lynch Asia Pacific Telecom, Media & Technology Virtual Conference held during March 15 – March 24, 2021.

The Company management will host one-on-one meetings with interested investors during the conference dates. Conference participation is by invitation only and registration is mandatory. For more information on the conference or to schedule a one-on-one meeting, please contact a Bank of America Merrill Lynch representative or the conference coordinator at: corp.eventsasia@bofa.com or justine.liao@bofa.com.

About Himax Technologies, Inc.

Himax Technologies, Inc. (NASDAQ:HIMX) is a fabless semiconductor solution provider dedicated to display imaging processing technologies. We are a worldwide market leader in display driver ICs and timing controllers used in TVs, laptops, monitors, smartphone, tablets, automotive, digital cameras, car navigation, virtual reality (VR) devices and many other consumer electronics devices. Additionally, we design and provide controllers for touch sensor displays, in-cell Touch and Display Driver Integration (TDDI) single-chip solutions, LED driver ICs, power management ICs, and LCOS micro-displays for augmented reality (AR) devices and head-up displays (HUD) for automotive. We also offer CMOS image sensors, wafer level optics for AR devices, 3D sensing and ultralow power smart sensing, which are used in a wide variety of applications such as smartphone, tablet, laptop, TV, PC camera, automobile, security, medical devices, home appliance and AIoT. Founded in 2001 and headquartered in Tainan, Taiwan, Himax currently employs around 2,000 people from three Taiwan-based offices in Tainan, Hsinchu and Taipei and country offices in China, Korea, Japan, Israel and the US. Himax has 3,016 patents granted and 550 patents pending approval worldwide as of February 28, 2021. Himax has retained its position as the leading display imaging processing semiconductor solution provider to consumer electronics brands worldwide.

http://www.himax.com.tw

Forward Looking Statements

Factors that could cause actual events or results to differ materially include, but not limited to, general business and economic conditions and the state of the semiconductor industry; market acceptance and competitiveness of the driver and non-driver products developed by the Company; demand for end-use applications products; reliance on a small group of principal customers; the uncertainty of continued success in technological innovations; our ability to develop and protect our intellectual property; pricing pressures including declines in average selling prices; changes in customer order patterns; changes in estimated full-year effective tax rate; shortages in supply of key components; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; our ability to collect accounts receivable and manage inventory and other risks described from time to time in the Company's SEC filings, including those risks identified in the section entitled "Risk Factors" in its Form 20-F for the year ended December 31, 2020 filed with the SEC, as may be amended.

Company Contacts:

Eric Li, Chief IR/PR Officer
Himax Technologies, Inc.
Tel: +886-6-505-0880
Fax: +886-2-2314-0877
Email: hx_ir@himax.com.tw
www.himax.com.tw

Karen Tiao, Investor Relations
Himax Technologies, Inc.
Tel: +886-2-2370-3999
Fax: +886-2-2314-0877
Email: hx_ir@himax.com.tw
www.himax.com.tw

Mark Schwalenberg, Director
Investor Relations - US Representative
MZ North America
Tel: +1-312-261-6430
Email: HIMX@mzgroup.us
www.mzgroup.us 

FAQ

What event will Himax Technologies attend in March 2021?

Himax Technologies will attend the 2021 Bank of America Merrill Lynch Asia Pacific Telecom, Media & Technology Virtual Conference from March 15 to March 24, 2021.

How can investors meet with Himax Technologies during the conference?

Interested investors can schedule one-on-one meetings with Himax Technologies' management during the conference.

What is the significance of the Bank of America Merrill Lynch Conference for HIMX?

The conference provides a platform for HIMX to connect with potential investors and showcase its semiconductor technologies.

Where is Himax Technologies headquartered?

Himax Technologies is headquartered in Tainan, Taiwan.

How many patents does Himax Technologies hold?

As of February 28, 2021, Himax holds 3,016 granted patents and has 550 patents pending approval worldwide.