Flex Announces Liquid-Cooled Rack and Power Solutions for AI Data Centers at 2024 OCP Global Summit
Flex (NASDAQ: FLEX) has unveiled new reference platforms for liquid-cooled servers, racks, and power products at the 2024 OCP Global Summit, aimed at enabling sustainable data center growth. These innovations address challenges related to power, heat generation, and scale for AI and high-performance computing workloads.
Key announcements include:
- Customizable compute reference designs with JetCool's SmartPlate™ direct-to-chip liquid cooling solution
- A next-generation modular compute platform supporting Host Processor Module (HPM)
- Open Rack V3 (ORv3) compatible solutions for various rack configurations
- New Intermediate Bus Converters (IBC) for AI and cloud applications
Flex's comprehensive offerings span from advanced manufacturing to product lifecycle services, supporting the mass deployment of vertically integrated data center solutions.
Flex (NASDAQ: FLEX) ha presentato nuove piattaforme di riferimento per server refrigerati a liquido, rack e prodotti di alimentazione al Global Summit OCP 2024, volte a favorire la crescita sostenibile dei data center. Queste innovazioni affrontano le sfide legate a potenza, generazione di calore e scalabilità per carichi di lavoro di intelligenza artificiale e calcolo ad alte prestazioni.
Gli annunci principali includono:
- Design di riferimento personalizzabili per il calcolo con la soluzione di raffreddamento a liquido diretto al chip SmartPlate™ di JetCool
- Una piattaforma modulare di calcolo di nuova generazione che supporta il modulo del processore host (HPM)
- Soluzioni compatibili con Open Rack V3 (ORv3) per varie configurazioni di rack
- Nuovi convertitori di bus intermedi (IBC) per applicazioni di intelligenza artificiale e cloud
Le offerte complete di Flex spaziano dalla produzione avanzata ai servizi di ciclo di vita del prodotto, supportando il dispiegamento massiccio di soluzioni per data center verticalmente integrate.
Flex (NASDAQ: FLEX) ha presentado nuevas plataformas de referencia para servidores refrigerados por líquido, estantes y productos de energía en la Cumbre Global OCP 2024, con el objetivo de permitir un crecimiento sostenible de los centros de datos. Estas innovaciones abordan desafíos relacionados con potencia, generación de calor y escala para cargas de trabajo de inteligencia artificial y computación de alto rendimiento.
Los anuncios clave incluyen:
- Diseños de referencia personalizables para computación con la solución de refrigeración líquida SmartPlate™ de JetCool
- Una plataforma de computación modular de próxima generación que soporta el Módulo de Procesador Host (HPM)
- Soluciones compatibles con Open Rack V3 (ORv3) para varias configuraciones de estantes
- Nuevos Convertidores de Bus Intermedio (IBC) para aplicaciones de IA y en la nube
Las ofertas integrales de Flex abarcan desde fabricación avanzada hasta servicios de ciclo de vida del producto, apoyando el despliegue masivo de soluciones de centros de datos verticalmente integrados.
Flex (NASDAQ: FLEX)는 2024 OCP 글로벌 서밋에서 액체 냉각 서버, 랙 및 전원 제품에 대한 새로운 참조 플랫폼을 공개하며 지속 가능한 데이터 센터 성장을 지원하기 위해 노력하고 있습니다. 이러한 혁신은 인공지능 및 고성능 컴퓨팅 작업에 대한 전력, 열 발생 및 확장성과 관련된 문제를 해결합니다.
주요 발표 사항은 다음과 같습니다:
- JetCool의 SmartPlate™ 칩 직결 액체 냉각 솔루션을 적용한 맞춤형 컴퓨팅 참조 설계
- 호스트 프로세서 모듈(HPM)을 지원하는 차세대 모듈형 컴퓨팅 플랫폼
- 다양한 랙 구성에 대한 Open Rack V3 (ORv3) 호환 솔루션
- AI 및 클라우드 애플리케이션을 위한 새로운 중간 버스 변환기(IBC)
Flex의 포괄적인 제품은 고급 제조에서 제품 수명 주기 서비스에 이르기까지 다양하며, 수직 통합된 데이터 센터 솔루션의 대규모 배포를 지원합니다.
Flex (NASDAQ: FLEX) a dévoilé de nouvelles plateformes de référence pour serveurs refroidis par liquide, racks et produits électriques lors du Sommet Mondial OCP 2024, visant à favoriser une croissance durable des centres de données. Ces innovations répondent aux défis liés à la puissance, à la génération de chaleur et à l'évolutivité pour les charges de travail liées à l'intelligence artificielle et au calcul haute performance.
Les annonces clés incluent :
- Conceptions de référence personnalisables avec la solution de refroidissement liquide SmartPlate™ de JetCool
- Une plateforme de calcul modulaire de nouvelle génération prenant en charge le module de processeur hôte (HPM)
- Solutions compatibles avec Open Rack V3 (ORv3) pour diverses configurations de racks
- Nouveaux convertisseurs de bus intermédiaire (IBC) pour les applications IA et cloud
Les offres complètes de Flex vont de la fabrication avancée aux services de cycle de vie des produits, soutenant le déploiement massif de solutions de centres de données intégrés verticalement.
Flex (NASDAQ: FLEX) hat auf dem OCP Global Summit 2024 neue Referenzplattformen für flüssigkeitsgekühlte Server, Racks und Stromprodukte vorgestellt, die darauf abzielen, ein nachhaltiges Wachstum von Rechenzentren zu ermöglichen. Diese Innovationen gehen Herausforderungen im Zusammenhang mit Leistung, Wärmeentwicklung und Skalierung für KI- und hochleistungsorientierte Arbeitslasten nach.
Wichtige Ankündigungen umfassen:
- Anpassbare Rechenreferenzdesigns mit der SmartPlate™-Direktkühlungslösung von JetCool
- Eine modulare Rechenplattform der nächsten Generation, die das Host Processor Module (HPM) unterstützt
- Open Rack V3 (ORv3)-kompatible Lösungen für verschiedene Rack-Konfigurationen
- Neue Zwischenbus-Konverter (IBC) für KI- und Cloud-Anwendungen
Das umfassende Angebot von Flex reicht von fortschrittlicher Fertigung bis hin zu Dienstleistungen im Produktlebenszyklus und unterstützt den massenhaften Einsatz von vertikal integrierten Rechenzentrumslösungen.
- Launch of new liquid-cooled servers and racks for AI workloads
- Partnership with JetCool for advanced cooling solutions
- Introduction of customizable Open Rack V3 (ORv3) compatible solutions
- Expansion of power module offerings with new Intermediate Bus Converters (IBC)
- Comprehensive data center manufacturing capabilities and services
- None.
Insights
Flex's announcement introduces significant advancements in data center cooling and power management, important for AI and HPC workloads. The liquid-cooled servers and racks, particularly the JetCool SmartPlate™ integration, address the growing thermal challenges in high-density computing environments. This solution's ability to cool over 1,500W per socket is impressive, providing ample headroom for next-gen AI processors.
The modular compute platform supporting the Host Processor Module (HPM) offers flexibility for diverse AI applications, while the ORv3-compatible rack solutions demonstrate Flex's commitment to open standards and customization. The new Intermediate Bus Converters (IBCs) are particularly noteworthy, as they're tailored for the power distribution needs of AI and cloud infrastructures.
These innovations position Flex as a key player in the rapidly evolving AI data center market, offering integrated solutions from "grid to chip". This comprehensive approach could give Flex a competitive edge in serving hyperscalers and cloud providers looking to scale their AI capabilities efficiently and sustainably.
Flex's strategic move into advanced cooling and power solutions for AI data centers could significantly impact its financial performance. The company is positioning itself at the forefront of a high-growth market segment, as AI infrastructure spending is projected to surge in the coming years.
By offering end-to-end solutions from manufacturing to lifecycle services, Flex is diversifying its revenue streams and potentially improving its profit margins. The partnership with JetCool and the development of proprietary technologies like the Secure Control Module (SCM) 2.0 could lead to increased intellectual property value and market differentiation.
Investors should watch for potential revenue growth in Flex's data center segment, as well as any improvements in gross margins due to these higher-value offerings. The company's ability to scale these solutions and secure contracts with major cloud providers will be important indicators of success. While specific financial projections aren't provided, this move aligns well with industry trends and could drive long-term value for Flex.
New Flex solutions enable cloud service providers to address power, heat, and scale challenges in the AI era
News summary
- Flex launches new compute, rack, and intermediate bus converter products for AI data centers
- Flex and JetCool® partner for direct-to-chip liquid cooling
- Flex's ORv3-compatible rack integrated with single-phase liquid cooling, enabled for two-phase liquid cooling
"Flex delivers integrated data center IT and power infrastructure solutions that address the growing power and compute demands in the AI era," said Michael Hartung, president and chief commercial officer, Flex. "We are expanding our unique portfolio of advanced manufacturing capabilities, innovative products, and lifecycle services, enabling customers to deploy IT and power infrastructure at scale and drive AI data center expansion."
Flex is highlighting these new capabilities this week for the data center community during the OCP Global Summit in
Liquid-cooled servers and racks for AI workloads
Flex announced customizable, open standard-based, compute reference designs integrating JetCool's SmartPlate™ direct-to-chip liquid cooling solution. JetCool's patented microconvective cooling® technology extends the value of single-phase, direct-to-chip liquid cooling deployments because it cools over 1,500W per socket, more than enough headroom to accommodate the most advanced AI servers. JetCool and Flex separately announced a partnership to deliver liquid-cooled solutions at scale.
The Flex platform design is based on a next-generation modular compute platform supporting the Host Processor Module (HPM) customized to meet the unique requirements of different AI and HPC applications. This modular compute platform includes a new HPM that supports up to two Intel® Xeon® 6900 series with P-cores, the latest generation of data center processors from Intel. The platform also integrates the Flex Secure Control Module (SCM) 2.0, which is the next generation of the Flex SCM that delivers server management, security, and control functions in a common form factor. The platform complies with the OCP DC-MHS 2.0 and OCP DC-SCM 2.0 specifications and is deployable in racks compliant with the Open Rack V3 (ORv3) specification.
The Flex Open Rack V3 solution is both compatible with ORv3 specification and customizable to support 21" and 19" footprints for IT equipment, accommodating any rack configuration including liquid cooling. Flex is currently in volume production with leading hyperscalers delivering customized, ORv3-based rack designs at scale. Flex also manufactures ORv3-compliant power shelves, power supplies, and busbars as standalone products or as part of a vertically integrated solution.
New power modules expand offering
Flex Power Modules launched new Intermediate Bus Converters (IBC) designed to meet the needs of data centers powering AI, machine learning, and cloud applications. The new products expand the breadth of Flex Power Modules offerings for digital, non-isolated, unregulated IBCs.
Data center manufacturing capabilities, products, and services at scale
Flex delivers advanced manufacturing, data center IT and power infrastructure solutions from the grid to the chip, and product lifecycle services to address industry-wide challenges with power, heat, and scale. The company's cloud-focused manufacturing services span the value chain to support the mass deployment of vertically integrated data center racks from sourcing of materials and private-label components to the design, manufacturing, fulfillment and sustainable maintenance of servers, storage, racks, cabling, switches, bus bars, power shelves, and battery back-up, coupled with liquid cooling technologies. Flex power products enable data center operators to more efficiently manage power through innovative critical power infrastructure, such as switchgear and power distribution units, and embedded power at the server- and rack-levels, such as power modules and power shelves.
About Flex
Flex (Reg. No. 199002645H) is the manufacturing partner of choice that helps a diverse customer base design and build products that improve the world. Through the collective strength of a global workforce across 30 countries and responsible, sustainable operations, Flex delivers technology innovation, supply chain, and manufacturing solutions to diverse industries and end markets.
Flex Contacts
Investors & Analysts
David A. Rubin
Vice President, Investor Relations
(408) 577-4632
David.Rubin@flex.com
Media & Press
Michelle Kershner
Director, Commercial Integrated Marketing and Communications
(602) 421-6407
michelle.kershner@flex.com
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SOURCE Flex
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