Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai
DuPont is showcasing its advanced circuit materials and solutions at the International Electronic Circuits Exhibition 2025 in Shanghai from March 24-26. The company is presenting innovations designed for fine-line technology, signal integrity, and thermal management.
The showcase highlights several key products including Circuposit SAP8000 electroless copper for AI server applications, Microfill SFP-II-M acid plating copper for large AI chips, and Riston DI1600 & DI1600M dry film photoresist for IC substrate applications.
These solutions address the growing demands in the IC substrate and high-end PCB market, driven by AI servers, data centers, networking, autonomous vehicles, and 5G technologies. DuPont's portfolio includes dielectrics, metallization chemistries, and dry film imaging photoresists, focusing on performance, miniaturization, reliability, and cost efficiency.
DuPont sta presentando i suoi materiali e soluzioni avanzate per circuiti all'International Electronic Circuits Exhibition 2025 a Shanghai dal 24 al 26 marzo. L'azienda sta mostrando innovazioni progettate per la tecnologia a linee sottili, l'integrità del segnale e la gestione termica.
Il showcase mette in evidenza diversi prodotti chiave, tra cui Circuposit SAP8000 rame elettroless per applicazioni di server AI, Microfill SFP-II-M rame da placcatura acida per grandi chip AI, e Riston DI1600 & DI1600M fotoincisione a film secco per applicazioni su substrati IC.
Queste soluzioni rispondono alle crescenti esigenze nel mercato dei substrati IC e PCB di alta gamma, trainate da server AI, centri dati, networking, veicoli autonomi e tecnologie 5G. Il portafoglio di DuPont include dielettrici, chimiche di metallizzazione e fotoincisioni a film secco, con un focus su prestazioni, miniaturizzazione, affidabilità ed efficienza dei costi.
DuPont está presentando sus materiales y soluciones avanzadas para circuitos en la Exposición Internacional de Circuitos Electrónicos 2025 en Shanghái del 24 al 26 de marzo. La empresa está mostrando innovaciones diseñadas para tecnología de líneas finas, integridad de señal y gestión térmica.
La exhibición destaca varios productos clave, incluyendo Circuposit SAP8000 cobre electrolítico para aplicaciones de servidores de IA, Microfill SFP-II-M cobre de platinado ácido para grandes chips de IA, y Riston DI1600 & DI1600M fotoresistencias de película seca para aplicaciones de sustratos IC.
Estas soluciones abordan las crecientes demandas en el mercado de sustratos IC y PCB de alta gama, impulsadas por servidores de IA, centros de datos, redes, vehículos autónomos y tecnologías 5G. El portafolio de DuPont incluye dieléctricos, químicas de metalización y fotoresistencias de película seca, enfocándose en rendimiento, miniaturización, fiabilidad y eficiencia de costos.
듀폰은 2025년 3월 24일부터 26일까지 상하이에서 열리는 국제 전자 회로 전시회에서 고급 회로 재료와 솔루션을 선보입니다. 이 회사는 미세선 기술, 신호 무결성 및 열 관리를 위해 설계된 혁신을 발표하고 있습니다.
전시회에서는 Circuposit SAP8000 AI 서버 애플리케이션을 위한 무전해 구리, Microfill SFP-II-M 대형 AI 칩을 위한 산성 도금 구리, Riston DI1600 & DI1600M IC 기판 애플리케이션을 위한 건식 필름 포토레지스트 등 여러 주요 제품이 소개됩니다.
이러한 솔루션은 AI 서버, 데이터 센터, 네트워킹, 자율주행 차량 및 5G 기술에 의해 주도되는 IC 기판 및 고급 PCB 시장의 증가하는 수요를 충족합니다. 듀폰의 포트폴리오는 성능, 소형화, 신뢰성 및 비용 효율성에 중점을 두고 유전체, 금속화 화학물질 및 건식 필름 이미징 포토레지스트를 포함합니다.
DuPont présente ses matériaux et solutions avancés pour circuits lors de l'Exposition Internationale des Circuits Électroniques 2025 à Shanghai du 24 au 26 mars. L'entreprise met en avant des innovations conçues pour la technologie des lignes fines, l'intégrité du signal et la gestion thermique.
La présentation met en lumière plusieurs produits clés, notamment Circuposit SAP8000 cuivre sans électrolyse pour applications de serveurs IA, Microfill SFP-II-M cuivre de plaquage acide pour grands chips IA, et Riston DI1600 & DI1600M photoresist à film sec pour applications de substrats IC.
Ces solutions répondent aux demandes croissantes sur le marché des substrats IC et des PCB haut de gamme, soutenues par des serveurs IA, des centres de données, des réseaux, des véhicules autonomes et des technologies 5G. Le portefeuille de DuPont comprend des diélectriques, des chimies de métallisation et des photoresists à film sec, avec un accent sur la performance, la miniaturisation, la fiabilité et l'efficacité des coûts.
DuPont präsentiert seine fortschrittlichen Schaltkreis-Materialien und -Lösungen auf der Internationalen Elektronikschaltungsausstellung 2025 in Shanghai vom 24. bis 26. März. Das Unternehmen stellt Innovationen vor, die für Feinlinien-Technologie, Signalintegrität und Wärmemanagement entwickelt wurden.
Die Ausstellung hebt mehrere Schlüsselprodukte hervor, darunter Circuposit SAP8000 chemiefreies Kupfer für AI-Serveranwendungen, Microfill SFP-II-M säurebeschichtetes Kupfer für große AI-Chips und Riston DI1600 & DI1600M Trockenfilm-Photolack für IC-Substratanwendungen.
Diese Lösungen adressieren die wachsenden Anforderungen im Markt für IC-Substrate und High-End-PCBs, die durch AI-Server, Rechenzentren, Netzwerke, autonome Fahrzeuge und 5G-Technologien vorangetrieben werden. Das Portfolio von DuPont umfasst Dielektrika, Metallisierungschemien und Trockenfilm-Bildgebungs-Photolacke mit einem Fokus auf Leistung, Miniaturisierung, Zuverlässigkeit und Kosteneffizienz.
- Expanding product portfolio for high-growth AI and 5G markets
- Innovation in specialized materials for advanced AI chip manufacturing
- Technical solutions addressing miniaturization and performance demands
- None.
"As artificial intelligence (AI), machine learning, and 5G technologies continue to advance, the demand for high-performance devices is propelling innovations in packaging substrates and high-end PCBs," said Yuan Yuan Zhou, Global Business Director, Advanced Circuit & Packaging, DuPont. "With our cutting-edge materials and integrated solutions, we are helping PCB manufacturers meet the increasing needs for miniaturization, integration, and performance, paving the way for the next generation of AI-driven substrates. Our advancement in interconnect materials plays a critical role in enabling AI infrastructure to optimize speed, efficiency, and reliability."
DuPont is leveraging decades of expertise in material science to address the evolving demands of the rapidly expanding IC substrate and high-end PCB market, fueled by the surge from AI servers and data centers, networking, autonomous vehicles, and 5G. The IC substrate offerings encompass a wide array of solutions, including dielectrics, metallization chemistries for electroless copper seed layer, redistribution layer, copper pillars, solder bumps, and dry film imaging photoresists. This comprehensive portfolio tackles critical challenges in performance, miniaturization, reliability, and cost efficiency.
At the show, DuPont experts will be available at the company's booth to share their in-depth knowledge on technological innovations and industry trends. Attendees can explore DuPont's comprehensive solutions for the PCB market, featuring the following product offerings:
DuPont™ Circuposit™ SAP8000 electroless copper is an innovative SAP metallization technology designed for AI server CPU or GPU chip applications. This ionic-based catalyst electroless copper process is optimized for advanced packaging. It meets the demands for low-roughness dielectrics as well as low dielectric constant (Dk) and low dissipation factor (Df) properties essential for fine-line and high-frequency designs.
DuPont™ Microfill™ SFP-II-M acid plating copper is a novel pattern plating solution specifically designed to optimize pattern distribution for large AI chips. It is engineered to deliver consistent pattern distribution across large unit sizes, making it ideal for high-performance computing applications.
DuPont™ Riston® DI1600 & DI1600M dry film photoresist is an advanced fine line direct imaging photoresist solution specifically designed for IC substrate applications. It boasts exceptional fine line adhesion and resolution, paired with high-yield performance.
DuPont™ Riston® DWB8100M dry film photoresist is a high-performance direct imaging solution tailored for fine copper pillar and thick copper mSAP applications. It offers excellent fine line and via resolution, with strong bottom adhesion to minimize underplating risks. It ensures stable yield performance while providing a straight dry film and copper trace profile with low trace voids, making it optimal for advanced IC substrate applications.
About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.
DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, SM or ® are owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted.
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SOURCE DuPont
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