Compal at CloudFest 2025: SG720-2A/OG720-2A AI Server with ZutaCore Pioneers a New Era of High-Efficiency, Energy-Saving Data Centers!
Compal Electronics unveils its innovative SG720-2A/OG720-2A AI server at CloudFest 2025 in Germany. The 7U server features advanced specifications including support for 8x AMD Instinct™ MI325X GPUs with CDNA 3 architecture, delivering up to 20.9 PFLOPs in FP16 performance and exceeding 41.8 PFLOPs with FP8 computations.
The system incorporates 2TB of HBM3E memory with 48TB/s bandwidth and utilizes ZutaCore® HyperCool® 2-Phase DLC liquid cooling technology. Notable features include an optimized 850mm chassis depth, compatibility with standard EIA 19" and Open Rack v3 setups, and front-facing hot-pluggable I/Os.
Testing revealed the ZutaCore HyperCool technology achieved a partial Power Usage Effectiveness (pPUE) of 1.01, performing 5% better than single-phase liquid cooling solutions, positioning the server as an efficient solution for next-generation data centers.
Compal Electronics svela il suo innovativo server AI SG720-2A/OG720-2A al CloudFest 2025 in Germania. Il server 7U presenta specifiche avanzate, tra cui supporto per 8 GPU AMD Instinct™ MI325X con architettura CDNA 3, offrendo fino a 20,9 PFLOPs in prestazioni FP16 e superando i 41,8 PFLOPs con calcoli FP8.
Il sistema incorpora 2TB di memoria HBM3E con larghezza di banda di 48TB/s e utilizza la tecnologia di raffreddamento liquido ZutaCore® HyperCool® a 2 fasi DLC. Tra le caratteristiche notevoli ci sono una profondità del telaio ottimizzata di 850 mm, compatibilità con configurazioni standard EIA 19" e Open Rack v3, e I/O hot-plug frontali.
I test hanno rivelato che la tecnologia HyperCool di ZutaCore ha raggiunto un'efficacia parziale nell'uso dell'energia (pPUE) di 1,01, esibendo prestazioni superiori del 5% rispetto alle soluzioni di raffreddamento liquido a fase singola, posizionando il server come una soluzione efficiente per i data center di nuova generazione.
Compal Electronics presenta su innovador servidor AI SG720-2A/OG720-2A en CloudFest 2025 en Alemania. El servidor de 7U cuenta con especificaciones avanzadas, incluyendo soporte para 8 GPU AMD Instinct™ MI325X con arquitectura CDNA 3, ofreciendo hasta 20,9 PFLOPs en rendimiento FP16 y superando los 41,8 PFLOPs en cálculos FP8.
El sistema incorpora 2TB de memoria HBM3E con un ancho de banda de 48TB/s y utiliza la tecnología de refrigeración líquida ZutaCore® HyperCool® de 2 fases DLC. Las características notables incluyen una profundidad de chasis optimizada de 850 mm, compatibilidad con configuraciones estándar EIA de 19" y Open Rack v3, y E/S hot-plug en la parte frontal.
Las pruebas revelaron que la tecnología HyperCool de ZutaCore logró una Eficiencia de Uso de Energía parcial (pPUE) de 1,01, funcionando un 5% mejor que las soluciones de refrigeración líquida de fase única, posicionando al servidor como una solución eficiente para los centros de datos de próxima generación.
컴팔 일렉트로닉스가 독일 클라우드페스트 2025에서 혁신적인 SG720-2A/OG720-2A AI 서버를 공개했습니다. 이 7U 서버는 CDNA 3 아키텍처를 갖춘 8개의 AMD Instinct™ MI325X GPU를 지원하며, FP16 성능에서 최대 20.9 PFLOPs를 제공하고 FP8 계산에서는 41.8 PFLOPs를 초과합니다.
시스템은 2TB의 HBM3E 메모리와 48TB/s의 대역폭을 갖추고 있으며, ZutaCore® HyperCool® 2-Phase DLC 액체 냉각 기술을 사용합니다. 주목할 만한 특징으로는 최적화된 850mm 섀시 깊이, 표준 EIA 19인치 및 Open Rack v3 설정과의 호환성, 그리고 전면 핫 플러그 가능한 I/O가 있습니다.
테스트 결과 ZutaCore HyperCool 기술은 1.01의 부분 전력 사용 효율성(pPUE)을 달성하여 단일 단계 액체 냉각 솔루션보다 5% 더 나은 성능을 보였으며, 차세대 데이터 센터를 위한 효율적인 솔루션으로 서버를 자리매김했습니다.
Compal Electronics dévoile son innovant serveur AI SG720-2A/OG720-2A lors du CloudFest 2025 en Allemagne. Le serveur 7U présente des spécifications avancées, y compris la prise en charge de 8 GPU AMD Instinct™ MI325X avec architecture CDNA 3, offrant jusqu'à 20,9 PFLOPs en performance FP16 et dépassant 41,8 PFLOPs avec des calculs FP8.
Le système intègre 2 To de mémoire HBM3E avec une bande passante de 48 To/s et utilise la technologie de refroidissement liquide ZutaCore® HyperCool® à 2 phases DLC. Parmi les caractéristiques notables, on trouve une profondeur de châssis optimisée de 850 mm, une compatibilité avec les configurations standard EIA 19" et Open Rack v3, ainsi que des E/S hot-plug à l'avant.
Les tests ont révélé que la technologie HyperCool de ZutaCore a atteint une efficacité partielle d'utilisation de l'énergie (pPUE) de 1,01, offrant des performances 5% supérieures à celles des solutions de refroidissement liquide à phase unique, positionnant le serveur comme une solution efficace pour les centres de données de nouvelle génération.
Compal Electronics präsentiert seinen innovativen SG720-2A/OG720-2A AI-Server auf der CloudFest 2025 in Deutschland. Der 7U-Server verfügt über fortschrittliche Spezifikationen, einschließlich Unterstützung für 8 AMD Instinct™ MI325X GPUs mit CDNA 3 Architektur, die bis zu 20,9 PFLOPs in FP16-Leistung und über 41,8 PFLOPs bei FP8-Berechnungen liefern.
Das System beinhaltet 2TB HBM3E-Speicher mit einer Bandbreite von 48TB/s und nutzt die ZutaCore® HyperCool® 2-Phase DLC Flüssigkeitskühltechnologie. Zu den bemerkenswerten Eigenschaften gehören eine optimierte Gehäusetiefe von 850 mm, Kompatibilität mit Standard EIA 19" und Open Rack v3-Setups sowie frontseitige hot-pluggable I/Os.
Tests haben ergeben, dass die ZutaCore HyperCool-Technologie eine partielle Energieverbrauchseffizienz (pPUE) von 1,01 erreicht hat, was 5% besser ist als Lösungen mit einphasiger Flüssigkeitskühlung, und den Server als effiziente Lösung für Rechenzentren der nächsten Generation positioniert.
- Advanced GPU performance capabilities with 20.9 PFLOPs FP16 and 41.8 PFLOPs FP8
- Superior cooling efficiency with pPUE of 1.01, 5% better than alternatives
- Hot-swappable components reduce system downtime
- High-capacity memory system with 2TB HBM3E and 48TB/s bandwidth
- 7U form factor may limit rack density compared to smaller servers
RUST,
The SG720-2A/OG720-2A 7U AI server not only supports 8x AMD Instinct™ MI325X GPUs —built on the advanced CDNA 3 architecture up to 896GB/s Infinity Fabric™ bandwidth, which achieves a theoretical FP16 performance of approximately 20.9 PFLOPs with sparsity and exceeds 41.8 PFLOPs with sparsity in FP8 computations—but also incorporates total 2TB of high-speed HBM3E memory in the platform with up to 48TB/s of memory bandwidth, delivering unparalleled compute power and ultra-fast data access for large-scale AI inference and data processing. Additionally, it is equipped with the ZutaCore® HyperCool® 2-Phase DLC liquid cooling solution, and the synergistic integration of these technologies elevates the SG720-2A/OG720-2A's performance and operational stability to unprecedented levels.
With an optimized 850mm chassis depth, the SG720-2A/OG720-2A seamlessly integrates into a standard EIA 19" 1-meter-deep rack or Open Rack v3-compatible setup. It enhances power efficiency and simplifies management with front-facing, hot-pluggable I/Os, making it a scalable and high-performance solution for data centers.
Its modular architecture facilitates straightforward maintenance and upgrades, with independent component replacement that minimizes downtime, while hot-swappable PCIe slots offer the crucial advantage of minimizing downtime and maximizing efficiency by allowing for network card replacement or upgrades without shutting down the entire system.
Compal recently conducted an experiment to evaluate the efficiency of direct-to-chip liquid cooling methods, revealing that ZutaCore's HyperCool technology achieved an impressively low partial Power Usage Effectiveness (pPUE) of 1.01. In comparative testing against single-phase liquid cooling, HyperCool consistently outperformed across all test conditions with
At CloudFest 2025, Compal, in partnership with ZutaCore®, showcases cutting-edge core technologies and solutions for the data centers of the future. In addition to showcasing the all-new SG720-2A/OG720-2A, other leading-edge server technologies are also on display. Interested visitors are warmly invited to visit the exhibit and explore the latest advancements in AI and HPC technologies.
CloudFest 2025 – Compal Booth
Dates: March 17–20, 2025
Location: Europa-Park,
Booth Number: R07
About Compal
Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2024, Compal was recognized by CommonWealth Magazine as one of
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SOURCE COMPAL ELECTRONICS,INC.
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