Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards

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Cadence Design Systems wins four Open Innovation Platform Partner of the Year awards from TSMC for its EDA and IP design solutions.

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• Cadence Design Systems has been recognized with four Partner of the Year awards from TSMC for its EDA and IP design solutions. The awards highlight Cadence's collaboration with TSMC in developing innovative solutions for the global market. Cadence optimized its flows for TSMC's N2 and N3E process technologies, offering customers improved power, performance, and area goals. The company's AI-powered solutions, Cadence Cerebrus Intelligent Chip Explorer and Virtuoso Studio, provide automation capabilities for increased efficiency. Cadence also collaborated with TSMC on 3D front-end design partitioning, mmWave design solutions, and DSP IP integration.

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TSMC presented Cadence with awards for EDA and IP design solutions

SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has won four Open Innovation Platform^® (OIP) Partner of the Year awards from TSMC for its EDA and IP design solutions. Cadence was presented with awards for the joint development of the N2 and N3P design infrastructure, 3Dblox design prototyping solution, mmWave design solutions and DSP IP. The awards build upon the companies’ long-standing history of collaboration that has delivered many highly innovative SoC and advanced packaging design solutions to the global market.

The awards are based on the following TSMC collaborations:

• N2 and N3P Design Infrastructure: Cadence optimized its complete digital and custom/analog flows for the TSMC N2 and N3E process technologies to help customers achieve power, performance and area (PPA) goals and accelerate innovation. Additionally, Cadence’s AI-powered solutions, Cadence^® Cerebrus^™ Intelligent Chip Explorer and Virtuoso^® Studio, support these nodes, offering customers innovative automation capabilities to make them more efficient.
• Joint Development of 3Dblox Design Prototyping Solution: Design flows based on the Cadence Integrity^™ 3D-IC Platform support the TSMC 3Dblox standard for 3D front-end design partitioning in complex systems. The flows include system prototyping flows, which are optimized for all of TSMC’s latest 3DFabric^™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS^®) and System-on-Integrated-Chips (TSMC-SoIC^® ) technologies.
• Joint Development of mmWave Design Solutions: The new Cadence Virtuoso Studio was integrated into the TSMC N16 mmWave RF design reference flow and N6RF design reference flow, and support has been added for the N4P RF design reference flow. In addition, Cadence collaborated with TSMC to optimize the Virtuoso platform for the 79GHz mmWave design reference flow on TSMC’s N16 process.
• DSP IP: Cadence expanded its collaboration with TSMC’s Soft IP9000 team to certify Cadence Tensilica^® DSP IP in the TSMC integration flow.

“TSMC works continuously with our OIP design partners to enable technology advancements that make it faster and easier for customers to deliver competitive designs to market, simpler for customers to adopt our solutions,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “Cadence’s commitment to design excellence is exemplary, and the TSMC OIP Partner of the Year awards are a testament to their dedication to ongoing innovation.”

“By continuing to collaborate closely with TSMC, we’re constantly energized by the innovations our customers bring to life using our technologies,” said Dr. Chin-Chi Teng, senior vice president and general manager of the Digital & Signoff Group at Cadence. “It’s an honor to be recognized with these prestigious TSMC awards, and they are a testament to the work we’ve done to enable our customers to achieve their design and time-to-market goals.”

About Cadence

Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

© 2023 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

Category: Featured

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For more information, please contact:

Cadence Newsroom

408-944-7039

newsroom@cadence.com

Source: Cadence Design Systems, Inc.

FAQ

What awards did Cadence Design Systems win from TSMC?

Cadence Design Systems won four Open Innovation Platform Partner of the Year awards from TSMC for its EDA and IP design solutions.

What collaborations did Cadence have with TSMC?

Cadence collaborated with TSMC on optimizing flows for N2 and N3E process technologies, 3D front-end design partitioning, mmWave design solutions, and DSP IP integration.

What are Cadence's AI-powered solutions?

Cadence's AI-powered solutions include Cadence Cerebrus Intelligent Chip Explorer and Virtuoso Studio.

What benefits do Cadence's solutions offer to customers?

Cadence's solutions offer improved power, performance, and area goals, as well as automation capabilities for increased efficiency.

What did TSMC say about Cadence's commitment to design excellence?

TSMC praised Cadence's commitment to design excellence and recognized their dedication to ongoing innovation.