Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip’s Data Center Solutions SoC Development
Palladium Z2 Emulation enabled Microchip to achieve 1.5X faster run-time performance and 2X better emulation capacity
The Palladium Z2 platform provides an early model of the ASIC for Microchip’s software and firmware development teams, which is essential to meeting their goal of successful first-pass silicon and software integration. Leveraging the congruency of the Palladium and Cadence Protium™ Enterprise Prototyping databases, Microchip saved several weeks of FPGA prototyping bring-up and hardware and software integration debugging time. In addition to providing the same RTL databases, the Palladium and Protium dynamic duo offers design environments that share the same in-circuit and virtual interfaces, making the debug process completely seamless and transparent to software and hardware engineers.
“At Microchip, we develop highly complex and secure SOC solutions for leading cloud data center providers that require robust verification platforms that can easily handle our multi-chip systems,” said
The Palladium Z2 Enterprise Emulation Platform and Protium X2 Enterprise Prototyping system are part of the Cadence verification full flow and support the company’s Intelligent System Design™ strategy. The Cadence verification full flow is comprised of core engines and verification fabric technologies that increase verification throughput and design quality, fulfilling verification requirements for a wide variety of applications and vertical segments. For more information on the Palladium Z2 platform, please visit www.cadence.com/go/palladiumz2cs.
About Cadence
Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For seven years in a row,
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