Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack

Rhea-AI Summary

Cadence Design Systems announces the qualification of its Integrity 3D-IC platform by Samsung Foundry, enabling advanced 2D-to-3D partitioning for improved power, performance, and area (PPA) in chip design. This solution automates the creation of memory-on-logic configurations for hyperscale computing, mobile, automotive, and AI applications. The platform enhances 3D stacking by reducing memory latency and wirelength, thus boosting CPU performance and facilitating comprehensive system analysis.

Positive

• Integration of 2D-to-3D partitioning flow enhances PPA for chip designs.
• Automated flow allows seamless implementation of 3D memory-on-logic configurations.
• Supports complex applications in hyperscale computing, mobile, automotive, and AI.
• Improves CPU performance by addressing memory latency issues.

Negative

• None.

Highlights:

• Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA optimization
• Native 3D partitioning flow automates intelligent creation of memory-on-logic 3D stacking configuration, providing PPA improvements for 3D stack designs
• Customers can confidently adopt the Cadence Integrity 3D-IC platform and Samsung Foundry’s multi-die implementation flow to create next-generation hyperscale computing, mobile, automotive and AI applications

SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS), a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE^™), today announced that Samsung Foundry has qualified the Cadence^® Integrity^™ 3D-IC platform’s 2D-to-3D native 3D partitioning flow. Using the new flow, customers can partition existing 2D designs into 3D memory-on-logic configurations and achieve better power, performance and area (PPA) with a homogeneous 3D stack when compared with the original 2D design. The flow also provides robust 3D-IC system planning, implementation and early analysis capabilities for the partitioned design, which is ideal for customers creating complex, next-generation hyperscale computing, mobile, automotive and AI applications.

Hitting a memory wall where RAM access cannot keep pace with CPU execution speed causes the overall system to slow down due to memory latency. One way to overcome this is to place memories on top of the logic in a homogenous stacking configuration. The configuration, when mounted on the same package, reduces wirelength and area and speeds up memory access, thus helping to improve the performance of the CPU core.

The Integrity 3D-IC platform’s 3D partitioning enables the user to separate out memory macros and standard cells and place them on two different dies within a 3D homogeneous stack. The automated flow performs partitioning and full implementation of the 3D stack while building connections between the macros and standard cells. Once the contents of each die are finalized, the system and package can be implemented in the Integrity 3D-IC platform, enabling bump planning, implementation, co-design with other dies, and early analysis of thermal, power and static timing analysis (STA).

“Customers faced with varying automated partitioning requirements for 3D-IC configurations can take advantage of this unique capability in Samsung Foundry’s MDI reference flow based on Native 3D partitioning in Cadence’s new Integrity 3D-IC platform to explore the effects of chip stacking,” said Sangyun Kim, vice president of Foundry Design Technology Team at Samsung Electronics. “This successful cooperation between Cadence and Samsung provides customers with a partitioning, implementation and analysis flow for stacked 3D designs that enables them to reduce power consumption and area while improving overall system performance.”

“Through our ongoing collaboration with Samsung Foundry, we’ve collaborated to innovate in the area of multi-die implementation and deliver automated Native 3D partitioning flows,” said Vivek Mishra, corporate vice president, Product Engineering in the Digital & Signoff Group at Cadence. “Samsung Foundry’s advanced packaging for multi-die implementation, combined with Cadence’s unified Integrity 3D-IC platform, provides our mutual customers with robust multi-die solutions.”

The Integrity 3D-IC platform provides customers with a common cockpit and database, a complete planning system, seamless implementation tool integration, integrated system-level analysis capabilities and an easy-to-use interface and lets users co-design with the Virtuoso^® Design Environment and Allegro^® packaging technologies. The platform also includes a broader Cadence 3D-IC solution portfolio including the Voltus^™ IC Power Integrity Solution for power delivery network (PDN) analysis, Celsius^™ Thermal Solver for 3D thermal analysis, Tempus^™ Timing Signoff Solution for 3D signoff timing and Pegasus^™ Verification System for system layout-versus-schematic (LVS). For more information on the Integrity 3D-IC platform, please visit www.cadence.com/go/Integrity3DICpl.

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design^™ strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For seven years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

© 2021 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

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Source: Cadence Design Systems, Inc.

FAQ

What is Cadence's Integrity 3D-IC platform?

The Integrity 3D-IC platform is Cadence's solution for integrating silicon and package planning for optimized chip designs, enabling 2D-to-3D partitioning.

How does the Integrity 3D-IC platform improve chip performance?

It enhances performance by employing memory-on-logic configurations that reduce memory latency and wirelength in 3D stack designs.

What applications can benefit from the Integrity 3D-IC platform?

The platform supports applications in hyperscale computing, mobile, automotive, and AI sectors.

When was the Integrity 3D-IC platform qualified by Samsung Foundry?

The qualification was announced in the press release dated November 17, 2021.

What benefits does the 3D partitioning flow provide?

It automates the partitioning process to create efficient 3D designs, optimizing power consumption and overall system performance.