UCIe™ (Universal Chiplet Interconnect Express™) Consortium Announces Incorporation and New Board Members; Open for Membership

Rhea-AI Summary

Advanced Semiconductor Engineering (ASE) and major tech companies have officially incorporated the UCIe Consortium to drive Universal Chiplet Interconnect Express (UCIe) technology forward. This consists of founding members such as AMD, Google Cloud, Intel, Microsoft, and newly-elected members Alibaba and NVIDIA, totaling over 60 member organizations. The UCIe 1.0 specification is now available, enabling a standardized chiplet ecosystem. The consortium invites new members to join and contribute to the development of future specifications.

Positive

• Official incorporation of the UCIe Consortium marks a significant milestone in advancing chiplet technologies.
• UCIe 1.0 specification enables a standardized die-to-die interconnect, facilitating a multi-vendor ecosystem.

Negative

• Concerns about potential fragmentation in chiplet technology without unified industry standards.

Key Highlights:

• The UCIe Consortium Board includes founding members Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung Electronics, and Taiwan Semiconductor Manufacturing Company, and newly-elected members, Alibaba and NVIDIA.
• UCIe Consortium was officially incorporated in Delaware in June and will drive the UCIe technology forward with specifications, compliance, and interoperability events to foster a universal interconnect at the package-level.
• UCIe Consortium is open for membership. Interested companies and institutions are encouraged to join.

BEAVERTON, Ore.--(BUSINESS WIRE)-- Today, Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung Electronics, and Taiwan Semiconductor Manufacturing Company announced the incorporation of the UCIe™ (Universal Chiplet Interconnect Express™) Consortium and unveiled two newly-elected Board members Alibaba and NVIDIA. The founding members announced the formation of the industry consortium in March 2022 and remain dedicated to advancing the UCIe specification to establish a chiplet ecosystem and future generations of chiplet technologies.

“The industry response to our announcement of UCIe has been overwhelmingly positive, and we’ve already had more than 60 companies now,” said Dr. Debendra Das Sharma, Chairman, UCIe Consortium. “Our official incorporation is a great milestone as we have an ambitious plan to continue evolving UCIe technology to meet industry requirements and develop a global interoperable chiplet ecosystem.”

UCIe 1.0 Specification – Available to Download

The UCIe 1.0 specification provides a complete standardized die-to-die interconnect with physical layer, protocol stack, software model, and compliance testing. The specification leverages the established PCI Express® (PCI-SIG®) and Compute Express Link™ (CXL™) industry standards. It will enable end users to easily mix and match chiplet components from a multi-vendor ecosystem for System-on-Chip (SoC) construction, including customized SoC. The evaluation copy of the UCIe 1.0 specification is available for download here.

Join the UCIe Consortium

The promoter companies include leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers. UCIe Consortium welcomes interested companies and institutions to join the organization as Contributors to help shape future UCIe specifications. For membership information, contact admin@UCIexpress.org.

Resources

• Download the UCIe Specification
• Access the UCIe Membership Agreement
• UCIe Board of Directors
• Statement from UCIe Board Directors

About UCIe™ Consortium

The UCIe Consortium is an industry consortium dedicated to advancing UCIe™ (Universal Chiplet Interconnect Express™) technology, an open industry standard that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. UCIe Consortium is led by key industry leaders Advanced Semiconductor Engineering, Inc. (ASE), Alibaba, AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, NVIDIA, Qualcomm Incorporated, Samsung Electronics, and Taiwan Semiconductor Manufacturing Company. For more information, visit www.UCIexpress.org.

PCI-SIG, PCI Express, and PCIe are registered trademarks of PCI-SIG. Compute Express Link™ and CXL™ Consortium are trademarks of the Compute Express Link Consortium. All other trademarks are the property of their respective owners.

View source version on businesswire.com: https://www.businesswire.com/news/home/20220802005203/en/

Rachael Watson

+1 971-706-1312

press@uciexpress.org

Source: Universal Chiplet Interconnect Express

FAQ

What is the UCIe Consortium and its purpose?

The UCIe Consortium aims to advance UCIe technology, providing standardized interconnects for chiplets to create a universal ecosystem.

When was the UCIe Consortium officially incorporated?

The UCIe Consortium was officially incorporated in June.

Who are the founding members of the UCIe Consortium?

Founding members include ASE, AMD, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC.

What is the significance of the UCIe 1.0 specification?

The UCIe 1.0 specification provides a complete standard for die-to-die interconnects, allowing integration of chiplet components from multiple vendors.

How many companies are currently part of the UCIe Consortium?

There are currently over 60 companies involved in the UCIe Consortium.