Ansys to Drive Major Advances in AI-Powered Semiconductor Design Using NVIDIA AI
Ansys (NASDAQ: ANSS) announces integration of NVIDIA Modulus AI framework into its semiconductor simulation products to accelerate design optimization. The integration with Ansys SeaScape platform will enable engineers to create customized AI models for faster design iterations. The technology has demonstrated over 100x speed-up for thermal simulations and will enhance product development for GPUs, HPC chips, AI chips, and smartphone processors. The integration will be implemented across Ansys' semiconductor solutions including RedHawk-SC, Totem-SC, PathFinder-SC, and RedHawk-SC Electrothermal.
Ansys (NASDAQ: ANSS) annuncia l'integrazione del NVIDIA Modulus AI framework nei suoi prodotti di simulazione dei semiconduttori per accelerare l'ottimizzazione del design. L'integrazione con la piattaforma Ansys SeaScape permetterà agli ingegneri di creare modelli AI personalizzati per iterazioni di design più rapide. La tecnologia ha dimostrato oltre un incremento di velocità di 100 volte nelle simulazioni termiche e migliorerà lo sviluppo dei prodotti per GPU, chip HPC, chip AI e processori per smartphone. L'integrazione sarà attuata in tutte le soluzioni per semiconduttori di Ansys, inclusi RedHawk-SC, Totem-SC, PathFinder-SC e RedHawk-SC Elettrotermico.
Ansys (NASDAQ: ANSS) anuncia la integración del NVIDIA Modulus AI framework en sus productos de simulación de semiconductores para acelerar la optimización del diseño. La integración con la plataforma Ansys SeaScape permitirá a los ingenieros crear modelos de IA personalizados para iteraciones de diseño más rápidas. La tecnología ha demostrado una velocidad 100 veces superior en simulaciones térmicas y mejorará el desarrollo de productos para GPUs, chips HPC, chips de IA y procesadores de teléfonos inteligentes. La integración se implementará en todas las soluciones de semiconductores de Ansys, incluidos RedHawk-SC, Totem-SC, PathFinder-SC y RedHawk-SC Electrotermal.
Ansys (NASDAQ: ANSS)는 반도체 시뮬레이션 제품에 NVIDIA Modulus AI 프레임워크를 통합하여 설계 최적화를 가속화한다고 발표했습니다. Ansys SeaScape 플랫폼과의 통합은 엔지니어가 더 빠른 설계 반복을 위해 맞춤형 AI 모델을 생성할 수 있게 합니다. 이 기술은 열 시뮬레이션에서 100배 이상의 속도 향상을 보여주었으며, GPU, HPC 칩, AI 칩 및 스마트폰 프로세서의 제품 개발을 향상시킬 것입니다. 통합은 RedHawk-SC, Totem-SC, PathFinder-SC 및 RedHawk-SC 전자열 등 Ansys의 모든 반도체 솔루션에 적용됩니다.
Ansys (NASDAQ: ANSS) annonce l'intégration du NVIDIA Modulus AI framework dans ses produits de simulation de semi-conducteurs pour accélérer l'optimisation de la conception. L'intégration avec la plateforme Ansys SeaScape permettra aux ingénieurs de créer des modèles d'IA personnalisés pour des itérations de conception plus rapides. La technologie a démontré une augmentation de vitesse de plus de 100 fois pour les simulations thermiques et améliorera le développement de produits pour les GPU, les puces HPC, les puces IA et les processeurs de smartphones. L'intégration sera mise en œuvre dans toutes les solutions de semi-conducteurs d'Ansys, y compris RedHawk-SC, Totem-SC, PathFinder-SC et RedHawk-SC électrothermique.
Ansys (NASDAQ: ANSS) kündigt die Integration des NVIDIA Modulus AI Frameworks in seine Halbleitersimulationsprodukte an, um die Entwurfsoptimierung zu beschleunigen. Die Integration mit der Ansys SeaScape-Plattform ermöglicht es Ingenieuren, maßgeschneiderte KI-Modelle für schnellere Designiterationen zu erstellen. Die Technologie hat eine Geschwindigkeitssteigerung von über 100x bei thermischen Simulationen gezeigt und wird die Produktentwicklung für GPUs, HPC-Chips, KI-Chips und Smartphone-Prozessoren verbessern. Die Integration wird in allen Halbleiterlösungen von Ansys umgesetzt, einschließlich RedHawk-SC, Totem-SC, PathFinder-SC und RedHawk-SC Elektrothermisch.
- Integration with NVIDIA Modulus AI demonstrates 100x speed-up in thermal simulations
- Technology enhancement across multiple semiconductor product lines
- Expansion of capabilities for high-demand markets (GPUs, HPC chips, AI chips, smartphone processors)
- None.
Insights
This strategic integration of NVIDIA Modulus into Ansys' semiconductor simulation tools represents a significant technological leap in chip design optimization. The demonstrated 100x speed-up in thermal simulations is particularly noteworthy, as it addresses a critical bottleneck in semiconductor development.
The partnership leverages NVIDIA's AI expertise and Ansys' simulation capabilities to create a powerful synergy that could dramatically reduce time-to-market for complex chip designs. The ability to train AI models on existing design libraries to predict optimal configurations is a game-changing feature that could give Ansys a competitive edge in the
The integration across multiple Ansys platforms (RedHawk-SC, Totem-SC, PathFinder-SC) indicates a comprehensive approach that could significantly enhance the company's market position in semiconductor design tools, particularly as demand for AI and HPC chips continues to grow exponentially.
This collaboration addresses critical challenges in modern semiconductor design, where increasing complexity and power demands require more sophisticated simulation tools. The physics-informed AI approach is particularly valuable for next-generation chip designs, especially in the rapidly growing AI accelerator market.
The ability to accelerate thermal simulation by 100x could significantly reduce design iteration cycles, potentially saving months in development time for complex chips. This is important as thermal management becomes increasingly critical in high-performance computing and AI applications.
The timing is strategic, coinciding with the industry's push toward more advanced node processes and complex chip architectures. This could help Ansys capture a larger share of the growing semiconductor design software market, particularly in the AI chip segment where thermal and power optimization are critical challenges.
Integration of NVIDIA Modulus AI framework with the Ansys SeaScape platform will enable engineers to easily build customized AI solutions that can improve designer productivity and quickly identify optimal design configurations
/ Key Highlights
- NVIDIA Modulus artificial intelligence (AI) framework will be integrated into the Ansys SeaScape™ cloud-optimized big data analytics platform for electronic design automation, which has demonstrated a speed-up of thermal simulation by over 100x
- The Modulus physics-informed AI techniques strongly complement Ansys multiphysics simulation engines within SeaScape, including Ansys power integrity and reliability signoff platforms Ansys RedHawk-SC™, Ansys Totem-SC™, Ansys PathFinder-SC™, and Ansys RedHawk-SC Electrothermal™
- The integration will improve product outcomes for applications including graphics processing units (GPUs), high-performance computing (HPC) chips, AI chips, smartphone processors, and advanced analog integrated circuits
NVIDIA Modulus is a physics-AI framework to train and deploy models that combine physics-based domain knowledge with simulation data, allowing users to create customized AI engines tailored to their needs. As AI gets integrated into computer-aided engineering workflows, it is important for users to have a seamless and integrated pipeline that allows data generated by solvers to flow to AI frameworks used to train models. Integrating NVIDIA Modulus framework into the Ansys SeaScape platform will enable customers to use high-fidelity data generated by Ansys tools to train their AI engines and then use the newly created engine for more robust design exploration.
For example, designers can train their AI models in the integrated Modulus framework using their library of completed designs in Ansys RedHawk-SC. Once the AI is trained, it can be used to identify optimal designs based on desired specifications — such as size, power, and performance — in a fraction of the time. Ansys plans to add Modulus-created AI accelerators to its semiconductor solutions including RedHawk-SC, Totem-SC, PathFinder-SC, and RedHawk-SC Electrothermal for faster thermal simulation and easier power calculation. With this AI-enhanced process, Ansys and NVIDIA have demonstrated over 100x speed-up for thermal simulations.
"NVIDIA has been collaborating closely with Ansys as both a partner and a customer for many years," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "Ansys' advancements in semiconductor design solutions have been fueled and enabled by NVIDIA's powerful chips, and the collaboration continues to bring state-of-the-art EDA tools to our mutual customers."
"NVIDIA Modulus makes it easy to train and deploy AI models that are physics-informed and reflect real-world causality," said Tim Costa, senior director of CAE, EDA & quantum and HPC at NVIDIA. "The integration with Ansys simulation products for multiphysics semiconductor design are ideal applications for Modulus to enhance simulation speed and efficiently identify the best design solutions."
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