Ansys 2024 R2 Delivers Multiphysics Innovation Across Industries and Engineering Domains
Ansys (NASDAQ: ANSS) has released its 2024 R2 software update, focusing on multiphysics innovation across industries and engineering domains. The release introduces two new products: Ansys TwinAI™ for enhancing simulation with AI for digital twins, and Ansys HFSS-IC™ solver for deep electromagnetic analysis of integrated circuits.
Key enhancements include streamlined multiphysics workflows, improved connected workflows across the Ansys portfolio, and AI integrations for various applications. The update also features hardware compatibility improvements, including optimization for GPUs and support for AMD GPUs in Ansys Fluent®.
These advancements aim to accelerate run times, scale capacity, enable digital transformation, and provide hardware flexibility, making Ansys multiphysics simulations more accessible and powerful for customers across industries.
Ansys (NASDAQ: ANSS) ha rilasciato il suo aggiornamento software 2024 R2, focalizzandosi su innovazione multifisica in vari settori e ambiti ingegneristici. Il rilascio introduce due nuovi prodotti: Ansys TwinAI™ per migliorare le simulazioni con AI per i gemelli digitali, e Ansys HFSS-IC™ solver per un'analisi elettromagnetica approfondita dei circuiti integrati.
Le principali migliorie includono flussi di lavoro multifisici semplificati, flussi di lavoro connessi migliorati attraverso il portafoglio Ansys e integrazioni AI per varie applicazioni. L'aggiornamento presenta anche miglioramenti della compatibilità hardware, tra cui ottimizzazioni per GPU e supporto per GPL AMD in Ansys Fluent®.
Questi progressi mirano ad accelerare i tempi di esecuzione, incrementare la capacità, abilitare la trasformazione digitale e fornire flessibilità hardware, rendendo le simulazioni multifisiche di Ansys più accessibili e potenti per i clienti in diversi settori.
Ansys (NASDAQ: ANSS) ha lanzado su actualización de software 2024 R2, centrándose en la innovación multifísica en diversas industrias y dominios de ingeniería. La nueva versión presenta dos productos nuevos: Ansys TwinAI™ para mejorar las simulaciones con IA para gemelos digitales, y Ansys HFSS-IC™ solver para un análisis electromagnético profundo de circuitos integrados.
Las mejoras clave incluyen flujos de trabajo multifísicos optimizados, mejoras en los flujos de trabajo conectados a través del portafolio de Ansys y integraciones de IA para diversas aplicaciones. La actualización también cuenta con mejoras en la compatibilidad del hardware, que incluyen optimización para GPUs y soporte para GPUs AMD en Ansys Fluent®.
Estos avances tienen como objetivo acelerar los tiempos de ejecución, ampliar la capacidad, habilitar la transformación digital y proporcionar flexibilidad de hardware, haciendo que las simulaciones multifísicas de Ansys sean más accesibles y potentes para los clientes en diferentes industrias.
Ansys (NASDAQ: ANSS)는 2024 R2 소프트웨어 업데이트를 출시하였으며, 다양한 산업 및 엔지니어링 분야에서의 다물리 혁신에 중점을 두고 있습니다. 이번 릴리스는 두 가지 신제품을 소개합니다: 디지털 트윈을 위한 AI 기반의 시뮬레이션 향상을 지원하는 Ansys TwinAI™와 통합 회로의 깊은 전자기 분석을 위한 Ansys HFSS-IC™ solver입니다.
주요 개선 사항으로는 간소화된 다물리 워크플로, Ansys 포트폴리오 전반에 걸친 개선된 연결된 워크플로, 다양한 응용 프로그램을 위한 AI 통합이 있습니다. 이 업데이트는 또한 하드웨어 호환성 개선을 특징으로 하며, GPU 최적화 및 Ansys Fluent®에서 AMD GPU 지원을 포함합니다.
이러한 발전은 실행 시간을 가속화, 용량을 확장, 디지털 변환을 가능하게 할 뿐만 아니라 하드웨어 유연성을 제공하여 Ansys의 다물리 시뮬레이션을 다양한 산업의 고객에게 더욱 접근 가능하고 강력하게 만드는 것을 목표로 하고 있습니다.
Ansys (NASDAQ: ANSS) a publié sa mise à jour logicielle 2024 R2, axée sur l'innovation multiphysique dans divers secteurs et domaines d'ingénierie. La sortie introduit deux nouveaux produits : Ansys TwinAI™ pour améliorer la simulation avec IA pour les jumeaux numériques, et Ansys HFSS-IC™ solver pour une analyse électromagnétique approfondie des circuits intégrés.
Les améliorations clés comprennent des flux de travail multiphysiques simplifiés, des flux de travail connectés améliorés à travers le portefeuille Ansys, et des intégrations IA pour diverses applications. La mise à jour présente également des améliorations de la compatibilité matérielle, y compris l'optimisation pour les GPU et le support des GPU AMD dans Ansys Fluent®.
Ces avancées visent à accélérer les temps de traitement, scaler la capacité, permettre la transformation numérique et offrir une flexibilité matérielle, rendant les simulations multiphysiques Ansys plus accessibles et puissantes pour les clients dans divers secteurs.
Ansys (NASDAQ: ANSS) hat sein Software-Update 2024 R2 veröffentlicht, das sich auf Multiphysik-Innovationen in verschiedenen Branchen und Ingenieurdomen konzentriert. Das Release führt zwei neue Produkte ein: Ansys TwinAI™ zur Verbesserung von Simulationen mit KI für digitale Zwillinge und Ansys HFSS-IC™ Solver für eine tiefgehende elektromagnetische Analyse von integrierten Schaltungen.
Wichtige Verbesserungen umfassen vereinfachte Multiphysik-Workflows, verbesserte verbundene Workflows im Ansys-Portfolio und KI-Integrationen für verschiedene Anwendungen. Das Update bietet außerdem Verbesserungen der Hardwarekompatibilität, einschließlich Optimierungen für GPUs und Unterstützung für AMD-GPUs in Ansys Fluent®.
Diese Fortschritte zielen darauf ab, Durchlaufzeiten zu beschleunigen, Kapazitäten zu skalieren, digitale Transformation zu ermöglichen und Hardwareflexibilität bereitzustellen, wodurch die Multiphysik-Simulationen von Ansys für Kunden in verschiedenen Branchen zugänglicher und leistungsfähiger werden.
- Introduction of two new products: Ansys TwinAI™ and Ansys HFSS-IC™ solver
- Streamlined multiphysics workflows for improved efficiency
- Enhanced AI integrations across various applications
- Improved hardware compatibility, including GPU optimization and AMD GPU support
- Accelerated run times and scaled capacity for simulations
- None.
Insights
Ansys is making significant strides with its 2024 R2 release, especially in the realm of multiphysics simulation. The introduction of software like Ansys TwinAI and Ansys HFSS-IC signifies a major leap towards integrating AI into complex design tasks. The ability to enhance digital twin simulations with AI for real-time, evolving insights can considerably shorten design cycles and improve accuracy. This is highly relevant for industries dealing with intricate designs, such as automotive and semiconductor sectors. By simplifying the process of connecting disparate software technologies, Ansys is reducing barriers for engineers, thus broadening the adoption of advanced simulation tools. This could lead to increased market share for Ansys as more businesses seek to streamline their design workflows.
Financially speaking, Ansys' latest release positions the company for potential revenue growth. The addition of AI-enhanced tools like Ansys TwinAI and HFSS-IC highlights a commitment to innovation, which could attract new customers and retain existing ones. The expansion of hardware compatibility and performance improvements also indicate a strategic move to stay ahead in the high-performance computing market. This could translate into a competitive advantage and increased sales. Moreover, the focus on sectors like automotive and semiconductor, which are seeing substantial investment and growth, further strengthens Ansys’ market positioning. Investors might see this as a bullish signal, anticipating an increase in demand for Ansys’ solutions.
From a market perspective, Ansys' 2024 R2 release is noteworthy for its potential to drive digital transformation across multiple industries. The integration of AI with traditional simulation tools helps solve complex engineering problems more efficiently, which is a growing need in today's tech-driven market. The enhancements in workflow connectivity and hardware flexibility make the Ansys portfolio more appealing to a broader range of industries. This can lead to higher adoption rates and expanded market penetration. The focus on optimizing performance in areas like electromagnetic analysis and NVH in electric vehicles addresses specific, high-demand applications, further strengthening Ansys' market position.
Latest release fuels collaboration and digital transformation by connecting workflows, integrating AI, and optimizing complex design tasks
/ Key Highlights
- Unified Ansys technology reduces the need for engineers to connect multiple, disparate software technologies, streamlining the product design process by providing advanced multiphysics simulation insights
- The latest release introduces two new products — Ansys TwinAI™ software for enhancing simulation with artificial intelligence (AI) for accurate, evolving digital twins and Ansys HFSS-IC™ solver for deep electromagnetic analysis of integrated circuits (IC)
"Ansys 2024 R2 makes our portfolio deeper, broader, smarter, and more connected than it's ever been," said Shane Emswiler, senior vice president of products at Ansys. "Customers rely on Ansys software that spans the entire range of physics and domains, from systems simulation to digital twins. We look forward to the truly transformational innovations our customers will engineer with Ansys' pervasive simulation insights and the expertise of the Ansys Customer Excellence support team."
Customers across industries will realize gains in productivity and collaboration through R2's enhancements to connected workflows across the Ansys portfolio.
"We are established users of Ansys enterprise tools and rely on the predictive accuracy, speed, and flexibility that its solutions like Ansys Discovery™ design tool provide," said Dr. Jon Powell, technical specialist simulations at Malvern Panalytical. "The same workflow can start in one engineering department and get passed to another without losing fidelity, all while saving huge amounts of time and effort."
Complex problems require comprehensive solutions
Ansys 2024 R2 streamlines multiphysics workflows, simplifying the process of connecting multiple, disparate software technologies across domains. The new release makes it easier for users to comprehensively evaluate cost and performance throughout a product's life cycle, from the most complex chips to electric vehicle powertrains.
Advanced packaging techniques for next-generation IC designs promise significant performance gains but increase design complexity. The new Ansys HFSS-IC solver addresses the growing complexity of today's advanced chip designs. Integrating Ansys' leading electronic and semiconductor technologies, the new HFSS-IC solver excels at deep electromagnetic analysis for IC signoff across power and signal integrity analysis — ensuring the final iteration delivers the performance demanded by next-generation electronic devices.
Increasingly complex multiphysics design challenges are permeating nearly every industry, including automotive. As companies seek to mature electric vehicle (EV) technology, optimizing noise, vibration, and harshness (NVH) in EV motors is crucial to vehicle performance and safety. Enhancements to Ansys Mechanical™ structural simulation software for e-powertrain workflows boost overall productivity of NVH analyses by delivering more accurate test correlation, acoustics simulation, and speed improvements.
This release also includes seamless data transfer between the Ansys Zemax® optical system design software and the Ansys Speos® optical performance analysis solver to more efficiently evaluate and optimize optical designs — including large systems with complex fields and wavelengths. For example, the integration unlocks streamlined straylight analysis for optical systems to help users eliminate unwanted effects caused by lens flare, light leakage, and scattering in optical systems.
From chips to missions to deployment: Ansys AI enhances solutions across domains
Ansys continues to deliver new use cases for AI, adding the Ansys TwinAI software to its portfolio. TwinAI software seamlessly combines insights from real-world data, powered by cutting-edge AI techniques, with the accuracy of multidomain models. This release also includes improvements to enable scaled deployments to the cloud or edge, allowing customers to unlock additional insights from real-world data.
"Innovation fuels progress, and at Tata Steel Nederland, we're pioneering a transformative journey towards sustainability," said Paul van Beurden, knowledge group leader – R&D, Tata Steel Nederland. "By harnessing the power of Ansys TwinAI software, we're optimizing our production processes, minimizing energy loss, and driving towards our decarbonization reduction targets of 30
The Ansys Missions AI + tool is a new technology that delivers algorithms focused on enhancing Ansys Digital Mission Engineering (DME) products. Engineers can automatically evaluate the quality of resulting orbit solutions with tuned models to provide expert-level analysis and enhanced safety of flight routines. Infusing AI into Ansys DME solutions allows users of varying simulation expertise to access and deploy the technology with ease.
Ansys AI integrations are also creating design efficiencies for nanometer-scale semiconductor applications. Ansys RaptorX™ electromagnetic modeling software now includes an AI-driven IC floorplan optimization solution, which identifies the ideal layout for mitigating electromagnetic coupling issues in analog and RF IC designs. By combining the power of the RaptorX solver with AI, users can reduce circuit footprint and shrink design time from weeks to days.
Ansys hardware partners and open ecosystem deliver blistering simulation speed
Ansys technology in 2024 R2 facilitates highly scalable high-performance computing (HPC) deployment, with all solver technologies optimized to run on central processing units (CPUs) and a growing list of solutions optimized for the latest graphics processing unit (GPU) hardware from multiple vendors. This list includes the Ansys AVxcelerate Sensors™ software for autonomous system testing, which now features adaptive grid sampling for long range object detection. Adaptive grid sampling allows simulation users to narrow their focus on specific objects within a virtual driving scenario to gather more targeted data. When compared to global sampling, which gathers all data from a driving scenario resulting in oversampling, the AVxcelerate Sensors enhancement delivers 3x faster simulation and 6.8x less GPU memory consumption with the same or better level of object detection and predictive accuracy.
Ansys Fluent® fluid simulation software boasts new hardware compatibility with AMD GPUs, supporting a broader selection of hardware options. Users working on acoustics, reacting flows, or subsonic/transonic compressible flows can now leverage the multi-GPU solver to run their simulations at exponentially faster speeds with the expansion of physics modeling capabilities. Embedded integration of Ansys optiSLang® process integration and design optimization software supports further exploration of design options through built-in parametric optimization.
Click here to learn more about Ansys 2024 R2.
/ About Ansys
Our Mission: Powering Innovation that Drives Human Advancement™
When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in
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