Aehr Test Systems to Participate in the 14th Annual CEO Investor Summit in San Francisco
Aehr Test Systems (NASDAQ: AEHR), a leading supplier of semiconductor test systems, announced that its CEO Gayn Erickson and CFO Ken Spink will participate in the 14th Annual CEO Summit on July 13, 2022, in San Francisco. They will discuss innovative semiconductor testing solutions serving critical markets, including electric vehicles and data centers. The company focuses on silicon carbide and gallium nitride technologies, which are key growth drivers. Presentation materials will be available on Aehr's investor relations website.
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FREMONT, Calif., July 11, 2022 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced that President and CEO Gayn Erickson and CFO Ken Spink are scheduled to participate in the 14th Annual CEO Summit investor conference being held July 13, 2022 at the St. Regis Hotel, San Francisco, CA.
“We look forward to discussing our semiconductor wafer level and singulated die test and burn-in solutions and the markets they serve with investors,” said Mr. Erickson. “We continue to be excited about the silicon carbide market for electric vehicles and electrification of the worldwide infrastructure, as well as gallium nitride that is used in both consumer applications and for photovoltaic and automotive applications. Aehr Test provides complete production solutions for improving yield and reliability of semiconductors, and devices such as silicon carbide semiconductors used in electric and hybrid electric vehicles, silicon photonics devices used in data centers and 5G infrastructure, and 2D/3D and other sensors used in mobile and wearable applications, which are expected to be significant revenue drivers for our products this fiscal year and next.”
The presentation material utilized at the CEO Summit will be made available on the investor relations page of the Company’s website at www.aehr.com.
About the 14th Annual CEO Summit
The CEO Summit is collectively hosted and funded by participating companies and features a “round-robin” format consisting of small group meetings with company management teams. During the event, investors and analysts will have the opportunity to meet with the majority of the 12 management teams during the small group meeting sessions, as well as opportunities to meet with management during the breakfast and lunch networking sessions.
This year’s CEO Summit is being co-sponsored by Cowen & Co., Intro-act, Jefferies and Stifel. Attendance at the CEO Summit is by invitation only and is available to accredited investors and publishing research analysts.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has installed over 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTS™ and FOX-P™ families of test and burn-in systems and FOX WaferPak™ Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The FOX-CP system is a new low-cost single-wafer compact test and reliability verification solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The WaferPak Contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.
Contacts:
| Aehr Test Systems | MKR Investor Relations Inc. |
| Ken Spink | Todd Kehrli or Jim Byers |
| Chief Financial Officer | Analyst/Investor Contact |
| (510) 623-9400 x309 | (323) 468-2300 |
| aehr@mkr-group.com |
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