Aehr Receives Over $4 Million in Orders for its FOX WaferPak™ Full Wafer Contactors to Support Production Test and Burn-in of Silicon Carbide Power Semiconductors for Electric Vehicles
Aehr Test Systems (NASDAQ: AEHR) has secured $4.4 million in orders from its lead customer for multiple WaferPak™ full wafer Contactors, aimed at increasing production capacity for silicon carbide power semiconductors catering to the electric vehicle market. Shipments are expected by the end of Aehr’s fiscal third quarter, concluding February 28, 2023. The company anticipates ongoing demand for FOX systems and WaferPak Contactors, contributing to their positive outlook for business growth in the automotive semiconductor sector.
- Secured $4.4 million in orders for WaferPak Contactors.
- Orders support increased production capacity for silicon carbide semiconductors used in electric vehicles.
- Positive customer growth forecast aligns with Aehr's expected business expansion.
- None.
FREMONT, Calif., Nov. 04, 2022 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has received
Gayn Erickson, President and CEO of Aehr Test Systems, commented, “We are excited to receive these follow-on orders for a significant number of WaferPaks to be used with previously shipped FOX-XP systems for high volume production of MOSFETS used in electric vehicle inverters and onboard chargers. This customer is a leading Fortune 500 supplier of semiconductor devices with a significant customer base in the automotive semiconductor market, and has publicly announced that they expect their growth rate to accelerate faster than previously forecasted. We are excited to participate in their ramp and meet their quality, reliability and capacity needs, and they continue to forecast orders for a significant number of FOX systems and WaferPak Contactors during this fiscal year and well into the future.
“Customers may initially purchase a small number of WaferPaks to be used in the characterization and qualification of devices with their customers, and then upon successful qualification and design wins, follow with orders like this for a significant number of WaferPaks to be used with the FOX-XP multi-wafer systems they have installed as they move into volume production.
“We continue to be very optimistic about our business. The FOX-XP system is critical for wafer level burn-in of silicon carbide devices to meet the quality and reliability needs of the automotive industry, and from our conversations with most all of the potential silicon carbide customers worldwide, it is very clear that there is a plan to move to wafer level burn-in for their devices. This is particularly true for the automotive space, where traction inverters are shifting to multi-chip modules that provide higher performance in terms of efficiency, cooling and system integration.”
The FOX-XP system, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as silicon carbide power devices, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has installed over 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge silicon carbide-based power semiconductors, memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The FOX-CP system is a new low-cost single-wafer compact test and reliability verification solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.
Safe Harbor Statement
This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr’s future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates,” “going to,” "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr’s new and existing customers; bookings forecasted for proprietary WaferPakTM and DiePak consumables; and expectations related to long-term demand for Aehr’s productions and the attractiveness of key markets. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.
Contacts:
| Aehr Test Systems | MKR Investor Relations Inc. |
| Vernon Rogers | Todd Kehrli or Jim Byers |
| EVP of Sales & Marketing | Analyst/Investor Contact |
| (510) 623-9400 x215 | (323) 468-2300 |
| vrogers@aehr.com | aehr@mkr-group.com |
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