Aehr Announces Shipment of New High-Power Configured FOX-XP(TM) System for Wafer Level Burn-in and Stabilization of Next Generation Silicon Photonics Integrated Circuits
- None.
- None.
Insights
The announcement by Aehr Test Systems about the shipment of a new high-power configuration of its FOX-XP system to a major silicon photonics customer is a significant development for the company and the semiconductor industry. This move suggests that Aehr is actively expanding its product offerings to cater to the evolving needs of the silicon photonics market, which is known for its rigorous power requirements for wafer level burn-in and stabilization.
From a market perspective, the adoption of silicon photonics is growing due to its potential to significantly increase the speed and efficiency of data transfer, particularly in data centers and high-performance computing environments. Aehr's ability to provide a solution that addresses the higher power demands of next-generation photonic ICs could position the company as a key player in the supply chain for these advanced technologies. This could potentially lead to increased market share and revenue growth, especially if the new system is well-received and becomes the industry standard for testing and burn-in processes.
Investors and stakeholders would be interested in monitoring the market's response to this new offering, as well as any subsequent orders from other customers, as these factors could influence the company's financial performance and stock valuation in the medium to long term.
The integration of high-power test capabilities into the FOX-XP system represents a technical advancement in the semiconductor equipment sector. The ability to test and stabilize wafers at up to four times the power per wafer is a clear response to the increasing complexity and power requirements of silicon photonics devices. These devices are critical for the advancement of optical I/O and co-packaged optics, which are expected to play a significant role in next-generation computing and communication systems.
For the semiconductor industry, this development underscores the importance of equipment that can keep pace with the rapid advancements in chip technology. Aehr Test Systems' commitment to compatibility across test programs and WaferPaks is also noteworthy, as it reduces the barrier to adoption for customers by ensuring that their existing investments remain relevant. This approach could lead to stronger customer loyalty and reduced churn, which are important factors for sustained business growth.
The technical community within the semiconductor industry will likely follow Aehr's progress closely, as the success of this high-power configuration could set a new standard for testing equipment and influence future design and manufacturing processes.
The strategic move by Aehr Test Systems to upgrade an existing customer's system to a new high-power configuration could have financial implications for the company. By leveraging an upgrade model, Aehr can potentially increase its revenue streams without the need for customers to invest in entirely new systems. This could result in a higher return on investment for both Aehr and its customers, fostering a more cost-effective approach to adopting new technologies.
However, the financial impact will depend on the company's ability to scale this solution and secure additional orders. The initial shipment is a positive indicator, but the long-term success will hinge on broader market acceptance. Investors should consider the potential risks associated with the adoption curve of new technologies, as well as Aehr's ability to execute on production and delivery at scale.
Given the competitive nature of the semiconductor industry, Aehr's financial performance will also be influenced by how competitors respond to this innovation. The ability to maintain a technological edge and secure a first-mover advantage could be critical in determining the company's market position and financial health in the coming years.
FREMONT, CA / ACCESSWIRE / March 1, 2024 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has shipped the first order from a major silicon photonics customer for a new high-power configuration of its FOX-XP™ system for volume production wafer level burn-in and stabilization of next generation silicon photonics integrated circuits (ICs).
This FOX-XP multi-wafer test and burn-in system is configured to enable cost-effective volume production test of wafers of next-generation photonic ICs, which can require up to two to four times as much power per wafer for test and burn-in and stabilization of the silicon photonics devices, and are targeted for use in the new optical I/O or co-packaged optics market.
Gayn Erickson, President and CEO of Aehr Test Systems, commented, "We are excited to have shipped this new high-power configuration that expands the market opportunities of the FOX-XP system. We were able to deliver these new capabilities and value through an upgrade of one of the customer's existing systems while maintaining backwards and forwards compatibility with all test programs, WaferPaks™, and correlation results of previous lower power wafers. This is a testament to our commitment to compatibility for our FOX platform.
"We remain very enthusiastic about the silicon photonics market, which includes the current photonics transceiver market used in data and telecommunications, as well as the new application of silicon photonics integrated circuits for use in optical chip-to-chip communication that we see as a significant market opportunity for our products.
"This new FOX-XP system configuration and WaferPaks allow for testing up to 8,192 high-power optical devices in parallel on each of nine wafers before they are singulated and placed into a fiberoptic transceiver for data center and telecommunications infrastructure or for placement in co-packaged optics for optical chip-to-chip communication. Multiple companies including AMD, Nvidia, Intel, TSMC, and GlobalFoundries have announced product roadmaps for devices using optical chip-to-chip communication."
The new FOX-XP system configuration with high-power WaferPaks enables production test of up to 3,500 watts of power per wafer and up to nine full wafers in parallel. It also includes Aehr's latest chamber configuration which has a smaller overall footprint and is compatible with Aehr's new WaferPak AutoAligner that Aehr began shipping last year. This provides Aehr customers with fully automated material handling in a hands-free operation of 6" to 12" wafers using industry standard wafer cassettes and Front Opening Unified Pods (FOUPs) and can also support mobile robot and overhead transport of wafers in FOUPs.
The FOX-XP and FOX-NP systems and proprietary WaferPaks are capable of functional test and burn-in/cycling of silicon carbide and gallium nitride power semiconductors, silicon photonics integrated circuits as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. For more information, please visit Aehr Test Systems' website at www.aehr.com.
Safe Harbor Statement
This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; bookings forecasted for proprietary WaferPakTM and DiePak consumables; and expectations related to long-term demand for Aehr's productions and the attractiveness of key markets. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.
| Aehr Test Systems | MKR Investor Relations Inc. |
| Vernon Rogers | Todd Kehrli or Jim Byers |
| EVP of Sales & Marketing | Analyst/Investor Contact |
| (510) 623-9400 x215 | (213) 277-5550 |
| vrogers@aehr.com | aehr@mkr-group.com |
SOURCE: Aehr Test Systems
View the original press release on accesswire.com
FAQ
What did Aehr Test Systems announce regarding a major silicon photonics customer?
What market opportunities does the new high-power configuration of the FOX-XP system expand?
Who is the President and CEO of Aehr Test Systems?
What is the commitment shown by Aehr Test Systems regarding system compatibility?
What is the main focus of the new high-power configuration of the FOX-XP system?
What type of equipment does Aehr Test Systems supply?
What is the ticker symbol for Aehr Test Systems?
