Adeia’s Pioneering Hybrid Bonding Technology Continues to Capture Attention

Rhea-AI Summary

Adeia (Nasdaq: ADEA) has announced significant advancements in their hybrid bonding technology, used in semiconductor packaging for high-performance computing applications like AI. The technology has garnered interest from major companies, including Kioxia and Western Digital, who have entered into long-term licensing agreements for Adeia's semiconductor patents. In 2024, Adeia's team actively participated in key industry events, presenting papers and tutorials on hybrid bonding. The company's innovations have been recognized through media interviews and an award for thought leadership. Hybrid bonding improves electrical and thermal performance, enabling smaller, more powerful devices. The technology's versatility benefits smartphones, wearables, IoT devices, and autonomous vehicles, driven by demand for higher-density interconnects and massive bandwidth.

Positive

• Kioxia and Western Digital's long-term licensing agreements demonstrate strong commercial interest in Adeia's technology.
• Hybrid bonding technology significantly improves electrical and thermal performance, beneficial for high-performance computing.
• Participation in key industry events and publications highlights Adeia's thought leadership in the semiconductor field.
• Award for 'Best Session Paper' at ECTC 2024 recognizes the company's intellectual contributions.
• Hybrid bonding allows for the development of smaller, more powerful electronic devices.

Negative

• No specific financial figures or revenue increases were mentioned.
• The press release does not detail any new commercial partnerships beyond the previously announced Kioxia and Western Digital agreements.
• No concrete data on the market uptake or direct financial impact of hybrid bonding technology is provided.

SAN JOSE, Calif., June 12, 2024 (GLOBE NEWSWIRE) -- Today, Adeia Inc. (Nasdaq: ADEA), a leading R&D and intellectual property (IP) licensing company known for bringing leading innovations in the semiconductor and media/entertainment technology sectors to market, announced recent developments in hybrid bonding a technology targeted toward the future of semiconductor packaging enabling high-performance computing capabilities, like those required for AI.

The company has experienced encouraging continued interest after its 2023 announcement that Kioxia Corporation and Western Digital, world leaders in flash memory and solid-state drives, entered into a long-term agreement to license Adeia’s semiconductor patent portfolio, including those relating to hybrid bonding.

Hybrid bonding is an advanced semiconductor packaging technology that enables the integration of different functional elements, such as logic, memory, and sensors, into compact and high-performance systems. It involves the use of a direct bond interconnect (DBI®) process to connect different semiconductor components, resulting in improved electrical and thermal performance.

Noted Publications and Speaking Roles

In early 2024, Adeia’s Semiconductor team gave a tutorial, “Design Considerations for Hybrid-Bonded Chiplets” and participated in a panel “Best Packaging for Chiplets Today”, at the Chiplet Summit. They also contributed a paper, "Surface Metrology and Defect Characterization for Hybrid Bonding” and presented at the International Microelectronics Assembly and Packaging Society, Device Packaging Conference 2024.

Continued Media Interest as the Ecosystem Adapts

Technology media continued to seek out the views of Laura Mirkarimi, SVP - Head of SEMI Engineering through interviews in 3DinCities and a forthcoming book that was reviewed entitled, Hybrid Bonding: The Time has Come - 3D InCites.

Award for Thought Leadership

Academics on Adeia’s semiconductor team, have also been awarded “Best Session Paper” at ECTC 2024 for their article entitled, “Fine Pitch Die-to-Wafer Hybrid Bonding” which discussed the root cause mechanisms of yield loss.

Outside Expectations for Market Growth

Adeia has been improving and expanding hybrid bonding technology for almost a decade following its acquisition of Ziptronix, one of the original founders of hybrid bonding. The future appears promising due to its numerous advantages. The technology allows for integration of chips, reducing the device size and enabling the development of smaller and more powerful electronic devices. The direct bond interconnect improves electrical and thermal conductivity, enabling faster and more efficient data transfer while reducing power consumption.

Hybrid bonding offers greater flexibility in system design, allowing for customization and optimization of various chip functionalities and process nodes. This versatility is applicable to a wide range of uses, including smartphones, wearables, high performance compute, Internet of Things (IoT) devices, and autonomous vehicles.

The market is witnessing significant growth due to the insatiable demand of higher density interconnect, for massive bandwidth to enable AI and edge compute. “This revolutionary interconnect allows chips manufactured separately to be joined seamlessly with improved function over traditional monolithically prepared circuits,” said Laura Mirkarimi, SVP Engineering. Pervasive heterogeneous integration is expected to continue for years.

About Adeia

Adeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia’s fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics. Adeia’s IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work and play. For more, please visit www.adeia.com.

For Information Contact:
Semiconductor Business Development
Yan Chai
marketing@adeia.com

Media Relations
JoAnn Yamani
press@adeia.com

FAQ

What recent developments has Adeia announced in hybrid bonding technology?

Adeia has announced advancements in hybrid bonding technology, used in semiconductor packaging for high-performance computing applications like AI.

Which companies have entered into long-term licensing agreements with Adeia?

Kioxia and Western Digital have entered into long-term licensing agreements for Adeia's semiconductor patents, including those related to hybrid bonding.

What are the benefits of Adeia's hybrid bonding technology?

Hybrid bonding improves electrical and thermal performance, reduces device size, and enables the development of more powerful electronic devices.

In which industry events did Adeia's team participate in 2024?

Adeia's team participated in the Chiplet Summit and the International Microelectronics Assembly and Packaging Society, presenting papers and tutorials on hybrid bonding.

What recognition has Adeia received for its work in hybrid bonding?

Adeia received the 'Best Session Paper' award at ECTC 2024 for their article on hybrid bonding.

What are the potential applications of Adeia's hybrid bonding technology?

Potential applications include smartphones, wearables, IoT devices, high-performance computing, and autonomous vehicles.