Adeia Enters into Long-Term Hybrid Bonding License Agreement with Hamamatsu Photonics
Adeia Inc. (Nasdaq: ADEA) has entered into a long-term hybrid bonding license agreement with Hamamatsu Photonics K.K., a leader in optical sensors and systems. The new license covers Adeia's semiconductor intellectual property portfolio for die-to-wafer hybrid bonding, complementing Hamamatsu's existing licenses for DBI® wafer-to-wafer hybrid bonding and ZiBond® wafer-to-wafer direct bonding technologies.
This agreement follows a prior development license that included a DBI Ultra® die-to-wafer hybrid bonding technology transfer. Hamamatsu plans to deploy these technologies in various semiconductor devices, including image sensors, photonics, and MEMS products. The partnership aims to expand the applicability of Adeia's hybrid bonding solutions to a wider range of optical sensors and diverse applications.
Adeia Inc. (Nasdaq: ADEA) ha stipulato un accordo di licenza a lungo termine per il bonding ibrido con Hamamatsu Photonics K.K., leader nei sensori e nei sistemi ottici. La nuova licenza copre il portafoglio di proprietà intellettuale sui semiconduttori di Adeia per il bonding ibrido die-to-wafer, complementando le licenze esistenti di Hamamatsu per le tecnologie di bonding ibrido wafer-to-wafer DBI® e bonding diretto wafer-to-wafer ZiBond®.
Questo accordo segue una precedente licenza di sviluppo che includeva il trasferimento della tecnologia di bonding ibrido die-to-wafer DBI Ultra®. Hamamatsu prevede di utilizzare queste tecnologie in vari dispositivi semiconduttori, tra cui sensori di immagine, fotonica e prodotti MEMS. La partnership mira ad ampliare l'applicabilità delle soluzioni di bonding ibrido di Adeia a una gamma più ampia di sensori ottici e applicazioni diverse.
Adeia Inc. (Nasdaq: ADEA) ha firmado un acuerdo de licencia de unión híbrida a largo plazo con Hamamatsu Photonics K.K., un líder en sensores y sistemas ópticos. La nueva licencia cubre el portafolio de propiedad intelectual de semiconductores de Adeia para unión híbrida die-to-wafer, complementando las licencias existentes de Hamamatsu para las tecnologías de unión híbrida wafer-to-wafer DBI® y unión directa wafer-to-wafer ZiBond®.
Este acuerdo sigue una licencia de desarrollo previa que incluía una transferencia de tecnología de unión híbrida die-to-wafer DBI Ultra®. Hamamatsu planea implementar estas tecnologías en varios dispositivos semiconductor, incluyendo sensores de imagen, fotónica, y productos MEMS. La asociación tiene como objetivo expandir la aplicabilidad de las soluciones de unión híbrida de Adeia a una gama más amplia de sensores ópticos y diversas aplicaciones.
Adeia Inc. (Nasdaq: ADEA)는 광학 센서 및 시스템의 선두주자인 Hamamatsu Photonics K.K.와 장기 하이브리드 본딩 라이선스 계약을 체결했습니다. 새로운 라이선스는 Adeia의 반도체 지식재산 포트폴리오를 die-to-wafer 하이브리드 본딩에 적용하며, Hamamatsu의 기존 DBI® 웨이퍼-투-웨이퍼 하이브리드 본딩 및 ZiBond® 웨이퍼-투-웨이퍼 직접 본딩 기술 라이선스를 보완합니다.
이번 계약은 DBI Ultra® die-to-wafer 하이브리드 본딩 기술 이전을 포함하는 이전 개발 라이선스에 이어진 것입니다. Hamamatsu는 이러한 기술을 이미지 센서, 광전자 및 MEMS 제품을 포함한 다양한 반도체 장치에 배포할 계획입니다. 이 파트너십은 Adeia의 하이브리드 본딩 솔루션을 더 넓은 범위의 광학 센서와 다양한 응용 분야에 확장하는 것을 목표로 합니다.
Adeia Inc. (Nasdaq: ADEA) a conclu un accord de licence de liaison hybride à long terme avec Hamamatsu Photonics K.K., un leader des capteurs et systèmes optiques. La nouvelle licence couvre le portefeuille de propriété intellectuelle en semi-conducteurs d'Adeia pour le liaison hybride die-to-wafer, complétant les licences existantes de Hamamatsu pour les technologies de liaison hybride wafer-to-wafer DBI® et de liaison directe wafer-to-wafer ZiBond®.
Ce contrat fait suite à une précédente licence de développement qui incluait un transfert de technologie pour la liaison hybride die-to-wafer DBI Ultra®. Hamamatsu prévoit de déployer ces technologies dans divers dispositifs semi-conducteurs, y compris des capteurs d'image, de la photonique et des produits MEMS. Le partenariat vise à étendre l'applicabilité des solutions de liaison hybride d'Adeia à un éventail plus large de capteurs optiques et d'applications diverses.
Adeia Inc. (Nasdaq: ADEA) hat eine langfristige Hybrid-Bonding-Lizenzvereinbarung mit der Hamamatsu Photonics K.K. geschlossen, einem führenden Unternehmen im Bereich optischer Sensoren und Systeme. Die neue Lizenz deckt das Portfolio an Halbleitergeistigem Eigentum von Adeia für Die-to-Wafer-Hybrid-Bonding ab und ergänzt die bestehenden Lizenzen von Hamamatsu für DBI® Wafer-to-Wafer-Hybrid-Bonding und ZiBond® Wafer-to-Wafer-Direktbonding-Technologien.
Dieser Vertrag folgt einer vorherigen Entwicklungs Lizenz, die einen Technologie Transfer für DBI Ultra® Die-to-Wafer-Hybrid-Bonding beinhaltete. Hamamatsu plant, diese Technologien in verschiedenen Halbleitergeräten, einschließlich Bildsensoren, Photonik und MEMS-Produkten, einzusetzen. Die Partnerschaft zielt darauf ab, die Anwendbarkeit der Hybrid-Bonding-Lösungen von Adeia auf ein breiteres Spektrum von optischen Sensoren und vielfältigen Anwendungen zu erweitern.
- New long-term license agreement with Hamamatsu Photonics for die-to-wafer hybrid bonding technology
- Expansion of existing partnership with a global leader in optical sensors and systems
- Potential for increased adoption of Adeia's technologies in diverse semiconductor applications
- None.
Insights
The new agreement between Adeia and Hamamatsu Photonics significantly embeds Adeia's die-to-wafer hybrid bonding technology into broader market applications. Hybrid bonding is important for enabling high-performance computing and advanced sensor technologies, both of which are core to emerging tech such as AI, autonomous systems and advanced imaging. Adeia's technologies like DBI® and ZiBond® are pivotal in making these advancements more efficient and scalable.
Hamamatsu Photonics, with its deep expertise in optical sensors, light sources and systems, stands to benefit tremendously. This agreement not only validates Adeia's innovations but also indicates a strong market demand for advanced semiconductor processing technologies. This could lead to enhanced performance in optical sensors and MEMS, driving future innovation in fields like medical imaging, environmental monitoring and industrial automation.
For investors, the extended partnership between Adeia and Hamamatsu underpins a robust growth trajectory for Adeia, as it signifies increasing adoption of its IP in critical semiconductor applications. This could translate into sustainable revenue streams and solidify Adeia's market position.
This licensing agreement represents a significant step forward for Adeia, potentially enhancing its revenue streams from its semiconductor IP portfolio. The expansion of Adeia's DBI Ultra® and ZiBond® technologies into Hamamatsu's product lines should lead to increased IP licensing fees and possibly royalties, contributing positively to Adeia's top and bottom lines.
Adeia's ability to secure such a strategic partner in Hamamatsu Photonics underscores the value and potential scalability of its technologies. It also highlights Adeia's strategic approach to reinforcing its position in the semiconductor market through collaborative partnerships. Investors should view this announcement as a positive indicator of Adeia's future financial performance and market positioning.
Moreover, the news could trigger a favorable market reaction, with potential uplift in Adeia's stock price as the market digests the long-term revenue implications of this agreement. This bodes well for long-term investors, who are likely to see enhanced shareholder value.
The extended licensing agreement between Adeia and Hamamatsu Photonics enables Adeia to penetrate deeper into high-growth markets, particularly those involving high-performance optical sensors and edge AI applications. Hybrid bonding technologies are becoming increasingly important across multiple sectors, including consumer electronics, automotive and healthcare industries, where miniaturization and performance efficiency are paramount.
This agreement exemplifies the growing trend of cross-industry collaborations to leverage specialized technologies for advanced product development. Adeia's proven track record in hybrid bonding solutions places it in a compelling position to address the escalating demands of modern semiconductor applications. Hamamatsu's market leadership in optical sensors and photonics provides a robust platform for effective implementation and market penetration of Adeia's IP.
For retail investors, this news indicates strong future growth potential for Adeia, driven by strategic alliances and expanding market applications. The partnership not only showcases Adeia's innovative prowess but also hints at potential market share gains in the high-performance semiconductor space.
“DBI, DBI Ultra and ZiBond technologies are currently being deployed in leading edge image sensor, photonics and MEMS products, and we look forward to expanding their applicability further in our various semiconductor devices,” said Takayuki Suzuki, Division Director, Solid State Division of Hamamatsu Photonics K.K.
"Our partnership with Hamamatsu, a global leader in optical sensors and systems, allows us to further expand the applicability of our hybrid bonding solutions to a wider range of optical sensors," said Dana Escobar, chief licensing officer and general manager, semiconductor, at Adeia. "We look forward to working together to proliferate these technologies in more diverse applications."
Adeia has pioneered fundamental advances in the semiconductor industry over the last 30 years. With a large and growing portfolio of intellectual property covering hybrid bonding, semiconductor packaging and semiconductor processing technologies, Adeia licenses and partners with leading semiconductor companies around the world.
About Adeia
Adeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia’s fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics. Adeia’s IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work and play. For more, please visit www.adeia.com.
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Investor Relations
Chris Chaney
IR@adeia.com
Media Relations
JoAnn Yamani
press@adeia.com
Source: Adeia
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