Adeia Demonstrates Hybrid Bonding Technology During Chiplet Summit 2024

Rhea-AI Summary

Adeia Inc. (Nasdaq: ADEA) is showcasing its hybrid bonding technology at the Chiplet Summit, highlighting its role in enabling next-generation high-performance semiconductor devices. The company's extensive portfolio of intellectual property covers hybrid bonding, advanced process nodes, and advanced packaging technologies, which it licenses and partners with leading semiconductor companies worldwide.

SANTA CLARA, Calif., Feb. 06, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), the company whose patented innovations enhance billions of devices, today announced that it is showcasing its hybrid bonding technology at the Chiplet Summit on February 6 through 8, 2024, at the Santa Clara Convention Center.

Over the past 30 years, Adeia has pioneered fundamental advances in the semiconductor industry. With an extensive and growing portfolio of intellectual property covering hybrid bonding, advanced process nodes and advanced packaging technologies, Adeia licenses and partners with leading semiconductor companies worldwide.

“Hybrid bonding is a key enabling technology for next-generation high performance semiconductor devices. The technology enables the disaggregation of the memory array and logic circuitry, to create new chiplet architectures. Adeia’s hybrid bonding technology is increasingly being adopted in sensors, memory chips and logic devices, enhancing performance and functionality while reducing size and cost,” added Laura Mirkarimi, senior vice president, engineering at Adeia.

To find demonstrations and presentations by Adeia during the Chiplet Summit, visit:

• Adeia Booth #317 – The Adeia team will showcase the latest innovations in hybrid bonding technology.

• Pre-Conference Tutorial C: Advanced Packaging Methods – Presentation by Thomas Workman, senior principal integration engineer for Adeia, on “Taking Advantage of Hybrid-bonded Chiplets in Designs” on Tuesday, Feb 6, 2024 from 8:30 am to 12:00 pm PST.

• Best Packaging for Chiplets Today – Adeia’s Laura Mirkarimi joins this panel session on Thursday, Feb 8, 2024 at 2:00 pm PST.
  

About Adeia

Adeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia’s fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics. Adeia’s IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work and play. For more, please visit www.adeia.com.

For Information Contact:
Investor Relations
Chris Chaney
IR@adeia.com

Media Relations
Stephanie Stocker
Conveyor Marketing
marketing@adeia.com

FAQ

What technology is Adeia showcasing at the Chiplet Summit?

Adeia is showcasing its hybrid bonding technology at the Chiplet Summit, enabling next-generation high-performance semiconductor devices.

What is the ticker symbol for Adeia Inc.?

The ticker symbol for Adeia Inc. is ADEA.

Who will be presenting at the Chiplet Summit for Adeia?

Thomas Workman, senior principal integration engineer for Adeia, will be presenting a tutorial on 'Taking Advantage of Hybrid-bonded Chiplets in Designs' on Tuesday, Feb 6, 2024, and Laura Mirkarimi, senior vice president, engineering at Adeia, will join a panel session on 'Best Packaging for Chiplets Today' on Thursday, Feb 8, 2024.

What is the focus of Adeia's hybrid bonding technology?

Adeia's hybrid bonding technology enables the disaggregation of the memory array and logic circuitry to create new chiplet architectures, increasingly being adopted in sensors, memory chips, and logic devices to enhance performance and functionality while reducing size and cost.