Axcelis Announces Shipment of Purion EXE Power Series Implanter to Leading SiC Power Device Chipmaker in Japan
- The power device market is one of the fastest growing segments in IC manufacturing.
- The Purion Power Series family is uniquely suited for handling multiple wafer sizes and various substrate types.
- Axcelis Technologies aims to expand the Purion platform footprint in Japan.
- None.
Axcelis' Leadership in the Power Device Segment Continues to Grow
Executive Vice President of Marketing and Applications, Greg Redinbo, commented, "The power device market is one of the fastest growing segments in IC manufacturing, due in part to the robust growth in the electric vehicles market. The power device market is at a critical inflection point as chipmakers transition from 150mm to 200mm SiC wafers. The Purion Power Series family is uniquely suited to excel at these applications due to its innovative platform that offers the flexibility to handle multiple wafer sizes, various substrate types and operate at various implant temperatures. We look forward to continuing to expand the Purion platform footprint in
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SOURCE AXCELIS TECHNOLOGIES, INC
FAQ
What product did Axcelis Technologies announce the shipment of?
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